公开(公告)号：WO2004009862A3

公开(公告)日：2004-03-18

申请号：PCT/US0322880

申请日：2003-07-22

申请人： BROOKS AUTOMATION INC

发明人： GILCHRIST ULYSSES ,  BEAULIEU DAVID R ,  VAN DER MEULEN PETER F

IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/027 ,  H01L21/3065 ,  H01L21/677

CPC分类号： B65G49/00 ,  H01L21/67772 ,  Y10S414/135 ,  Y10S414/14

摘要： A substrate processing apparatus having a station (140) for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station (140), apparatus (230, 235) for removing a door of a substrate magazine and thus opening the substrate magazine, and for operating the aperture closure to open the aperture, and an elevator (215) for precisely positioning the open substrate magazine along a vertical axis within a usable range of motion. The station (140) may also include a sensor (245) for mapping locations of the substrates, and a mini-environment for interfacing the station to a substrate processing system.

摘要翻译： 一种具有用于从该装置装载和卸载衬底的工位（140）的衬底处理装置，包括用于密封工位（140）的装载和卸载孔的孔口，用于移除衬底的门的装置（230,235） 并且因此打开基板盒，并且用于操作孔径封闭件以打开孔;以及电梯（215），用于在可用的运动范围内沿着垂直轴精确地定位打开的基板盒。 站（140）还可以包括用于映射基板的位置的传感器（245）和用于将站与基板处理系统对接的微型环境。

公开(公告)号：WO2004008054A1

公开(公告)日：2004-01-22

申请号：PCT/US2003/021648

申请日：2003-07-10

申请人： AVIZA TECHNOLOGY, INC. ,  QIU, Taiquing

发明人： QIU, Taiquing

IPC分类号： F26B3/30

CPC分类号： C23C16/46 ,  C23C16/4401 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/45578 ,  C23C16/54 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67772 ,  H01L21/67775

摘要： A method and apparatus for insulating and controlling temperature in a semiconductor manufacturing environment. The invention comprises at least one modular heater element designed to be mounted about a semiconductor furnace process chamber in order to minimize thermal transfer between the furnace interior and exterior. A base ring or cylinder (200, 500, 700) also referred to as a heater ring is sized to be fitted around an inner skin of a semiconductor mini-batch furnace. The base ring (200, 500, 700) has multiple channels (220, 520) equidistantly spaced about its inner perimeter. Heating coils of a type well known in the art may nest in these channels in order to warm the furnace interior. The coils may be either removably or permanently affixed within the channels.

摘要翻译： 一种用于在半导体制造环境中绝缘和控制温度的方法和装置。 本发明包括至少一个模块化加热器元件，其设计成围绕半导体炉处理室安装，以便最小化炉内部和外部之间的热传递。 也称为加热器环的基座或圆筒（200,500,700）的尺寸设置成围绕半导体小型间歇式炉的内表面安装。 基环（200,500,700）具有围绕其内周等距间隔的多个通道（220,520）。 本领域熟知的加热线圈可以嵌套在这些通道中，以加热炉内部。 线圈可以是可移除地或永久地固定在通道内。

公开(公告)号：WO02003431A2

公开(公告)日：2002-01-10

申请号：PCT/US2001/020954

申请日：2001-06-29

IPC分类号： B65G49/00 ,  H01L21/677 ,  H01L21/00

CPC分类号： H01L21/67775 ,  H01L21/67772

摘要： The invention relates generally to equipment for semiconductor wafer processing, for example, mechanisms and apparatus for handlig pods or containers for housing silicon wafers or substrates. The pod may be a front-opening unified pod or similar article and may house a carrier or cassette for holding the wafers or substrates. Additionally, the invention relates generally to an automated system for transporting a plurality of wafers in the pod for processing, loading the pod on the receiving station, sealig the pod against an interface, openeing the door of the pod, and shuttling the wafers into and out of a connected clean environment processing station, such as an ion implantation machine, using a robotic device.

摘要翻译： 本发明总体上涉及一种半导体晶片处理装置，例如用于容纳硅晶片或衬底的机构和容器处理装置。 该容器可以是统一的前部开口容器或类似物品，其可以包含用于承载切片或基底的保持器或盒子。 此外，本发明涉及一种自动系统，用于在容器中输送待处理的多个晶片，将容器装载到接收站中，将容器密封在接口上，打开容器门，以及 使用机器人装置将切片路由到生态处理站，尤其是离子植入机。

公开(公告)号：WO01004027A1

公开(公告)日：2001-01-18

申请号：PCT/US2000/015326

申请日：2000-05-31

IPC分类号： B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67775 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139

摘要： An automated door removal and replacement system (98) utilizes a combination of linear and rotational drive to remove a door (116) of a wafer supporting device (12) and store the door below the device. In one embodiment, the wafer-supporting device is a Front Opening Unified Pod (FOUP). A door-contacting assembly (114) is pivotally mounted to include a horizontal rest position and a vertical unlocking position. In the horizontal rest position, the assembly resides below the wafer-supporting device. The assembly is rotated to a vertical position and then linearly moved to engage the door. Keys (88, 90, 94 and 96) of the assembly are manipulated to release the door. The assembly and the door are moved rearwardly and the assembly is pivoted to the rest position, clearing the opening to the wafer-supporting device.

摘要翻译： 自动门移除和更换系统（98）利用线性和旋转驱动的组合来移除晶片支撑装置（12）的门（116）并将门存储在装置下方。 在一个实施例中，晶片支撑装置是前开口统一荚（FOUP）。 门接触组件（114）枢转地安装以包括水平静止位置和垂直解锁位置。 在水平静止位置，组件位于晶片支撑装置的下方。 组件旋转到垂直位置，然后线性移动以接合门。 组件的键（88,90,94和96）被操纵以释放门。 组件和门向后移动，组件枢转到静止位置，清除了到晶片支撑装置的开口。

公开(公告)号：WO00072375A1

公开(公告)日：2000-11-30

申请号：PCT/JP2000/003266

申请日：2000-05-22

IPC分类号： G03F7/20 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  H01L21/027

CPC分类号： H01L21/67751 ,  G03F7/70741 ,  G03F7/7075 ,  H01L21/67386 ,  H01L21/67772

摘要： There are provided a container base (104) on which a holder container (106) having an openable/closable door (108) and capable of housing a wafer holder (68) in a sealed state, an opening/closing mechanism (112) for opening/closing the door (108) in a state where the inside of the container (106) placed on the container base (104) is isolated from the outside, and a transfer system (100) for exchanging the holder on a stage (WST) for the holder in the container (106). The transfer system (100) can exchange holders in a short time in a state where the inside of the system is isolated from the outside, so that the system stop time is as short as possible and that the cleanliness of the holders can be always maintained high. As a result, the productivity of devices such as semiconductor devices is improved.

摘要翻译： 设置有容器基座（104），具有可打开/关闭门（108）并且能够容纳处于密封状态的晶片保持器（68）的保持器容器（106）的容器基座（104），用于 在放置在容器基座（104）上的容器（106）的内部与外部隔离的状态下打开/关闭门（108），以及用于在台架（WST）上更换保持件的传送系统 ）用于容器（106）中的保持器。 传送系统（100）可以在系统内部与外部隔离的状态下在短时间内更换支架，使得系统停止时间尽可能短，并且可以始终保持保持器的清洁度 高。 结果，提高了诸如半导体器件的器件的生产率。

公开(公告)号：WO00044653A1

公开(公告)日：2000-08-03

申请号：PCT/US2000/000031

申请日：2000-01-03

IPC分类号： B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67772 ,  H01L21/67781 ,  Y10S414/137 ,  Y10S414/14

摘要： A semiconductor wafer batchloading system comprises a portable carrier (32) for supporting and transporting wafers in a substantially particle free environment. A carrier door (42) is movable between an open position and a closed position overlying a carrier port (38) for sealing the interior of the carrier (32) from the surrounding environment. The carrier (32) is movable on a platform (60) between withdrawn and advanced positions for delivering multiple wafers to a wafer receiving station. The carrier door drive mechanism includes a generally planar door opener (102) movable between a lowered position and a raised position substantially coextensive with the carrier port. (38).

摘要翻译： 半导体晶片批量加载系统包括用于在基本上无颗粒环境中支撑和传输晶片的便携式载体（32）。 承载门（42）可在打开位置和覆盖承载口（38）的关闭位置之间移动，用于将承载件（32）的内部与周围环境密封。 载体（32）可在平台（60）之间移动，该平台（60）在抽出位置和前进位置之间，用于将多个晶片传送到晶片接收站。 托架门驱动机构包括大致平面的开门器（102），其可在下降位置和与承载口基本上共同延伸的升高位置之间移动。 （38）。

公开(公告)号：WO0007915A9

公开(公告)日：2000-08-03

申请号：PCT/US9917698

申请日：1999-08-05

申请人： ASYST TECHNOLOGIES

发明人： FOSNIGHT WILLIAM J ,  SHENK JOSHUA W

IPC分类号： B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

摘要： A system is disclosed for retaining a pod door (22) on a port door (26) at a load port, and for removing contaminants, particulates and/or gasses from between the pod and port door (26) surfaces and from within the interior of the pod door (22). According to a preferred embodiment of the present invention, a vacuum source (36) may be provided within, adjacent to, or remote from a process tool, which vacuum source (36) is connected to a vacuum port (34) in the front surface of a port door (26). The vacuum is provided to produce a negative pressure between juxtaposed surfaces of the port (26) and pod (22) doors.

摘要翻译： 公开了一种系统，用于将货舱门（22）保持在装载端口的端口门（26）上，并且用于从货舱和门口（26）表面之间以及从内部去除污染物，微粒和/或气体 的荚门（22）。 根据本发明的优选实施例，真空源（36）可以设置在处理工具内，邻近或远离处理工具，该真空源（36）连接到前表面中的真空端口（34） 的门口（26）。 提供真空以在端口（26）和荚（22）门的并置表面之间产生负压。

公开(公告)号：WO0002804A9

公开(公告)日：2000-07-27

申请号：PCT/US9915691

申请日：1999-07-12

申请人： ASYST TECHNOLOGIES

发明人： BONORA ANTHONY C ,  FOSNIGHT WILLIAM J ,  MARTIN RAYMOND S

IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67772 ,  H01L21/67775 ,  Y10S414/139 ,  Y10S414/14

摘要： A system is described herein including a load port (24) which allows various pod (32) sizes, including 200 mm and 300 mm, and various configurations, including front opening and bottom opening, to operate with a BOLTS interface (22), or simply with a vertical port on the front end of a process tool in configurations not including the BOLTS interface (22).

摘要翻译： 本文描述了一种系统，其包括负载端口（24），其允许包括200mm和300mm的各种荚（32）尺寸，以及包括前开口和底部开口的各种构造，以与BOLTS接口（22）一起操作，或 简单地在不包括BOLTS接口（22）的配置中，在处理工具的前端具有垂直端口。

公开(公告)号：WO00007915A1

公开(公告)日：2000-02-17

申请号：PCT/US1999/017698

申请日：1999-08-05

IPC分类号： B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67772 ,  Y10S414/139 ,  Y10S414/14

摘要： A system is disclosed for retaining a pod door (22) on a port door (26) at a load port, and for removing contaminants, particulates and/or gasses from between the pod and port door (26) surfaces and from within the interior of the pod door (22). According to a preferred embodiment of the present invention, a vacuum source (36) may be provided within, adjacent to, or remote from a process tool, which vacuum source (36) is connected to a vacuum port (34) in the front surface of a port door (26). The vacuum is provided to produce a negative pressure between juxtaposed surfaces of the port (26) and pod (22) doors.

摘要翻译： 一种用于在装载港口的入口门（26）上维持机舱门（22）并用于去除表面之间的污染物，颗粒和/或气体的系统 平台和入口门（26）以及平台门（22）的内部。 在本发明的一个优选实施例中，真空源（36）可以在处理工具内，与其相邻或远离处理工具，其中真空源（36）连接到孔口 真空阀（34）位于检修门（26）的前表面上。 真空意图在入口门（26）和机舱（22）的并置表面之间产生负压。

公开(公告)号：WO00002804A1

公开(公告)日：2000-01-20

申请号：PCT/US1999/015691

申请日：1999-07-12

IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67772 ,  H01L21/67775 ,  Y10S414/139 ,  Y10S414/14

摘要： A system is described herein including a load port (24) which allows various pod (32) sizes, including 200 mm and 300 mm, and various configurations, including front opening and bottom opening, to operate with a BOLTS interface (22), or simply with a vertical port on the front end of a process tool in configurations not including the BOLTS interface (22).

摘要翻译： 本发明涉及一种系统，该系统包括允许各种尺寸（包括200mm和300mm）和各种构造（包括底部的前开口和开口）的发动机舱（32）的装载开口（24） 使用开箱机装载机工具标准接口（BOLTS）接口进行操作 - 或者只需在配置中的工艺工具前端垂直开口 不包括BOLTS接口（22）。