Abstract:
An electrical connector with reduced cross talk and controlled impedance. The connector comprises hybrid shields with lossy portions and conductive portions. The synergistic effect of the lossy portions and the conductive portions allows the hybrid shields to be relatively thin such that they can be incorporated into the mating interface regions or other mechanically constrained regions of the connector to provide adequate crosstalk suppression without undesirably impacting impedance. The conductive portions may be shaped to preferentially position the conductive regions adjacent signal conductors susceptible to cross talk to further contribute to the synergy. The conductive regions may include holes to contribute to desired electrical properties for the connector.
Abstract:
An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and/or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.
Abstract:
Ceramic inserts and hermetically sealed or sealable connectors incorporating a ceramic insert providing conductive pathways between opposing faces and/or side-walls and fabricated using multi-layer ceramic fabrication techniques are described. Conductive pads provided as metalized surfaces on the ceramic insert facilitate conductive communication between the conductive pathways transiting the ceramic inserts and conductive structures contacting the conductive pads, such as sockets, pins, wires, and the like.
Abstract:
A telecommunications device comprising a faceplate including at least two adjacent jack receptacles, the two adjacent jack receptacles positioned vertically and horizontally offset to each other and a jack mounted in at least one of the two jack receptacles, the jack defining a port in the front end for receiving a plug, the jack also defining spring contacts within the port for making electrical contact with the plug, the jack including insulation displacement contacts electrically connected to the spring contacts, the insulation displacement contacts configured to establish electrical contact with conductors of a cable. A cap manufactured of a material configured to minimize transmission of electrical signal away from its intended path fits about the jack to cover at least a portion of the outer surface defined by the insulation displacement contacts.
Abstract:
The invention relates to a shielding cage (6) extending along a longitudinal axis (20) between a front side (21) and a rear side (22) and comprising a diecast metal section (7) extending from said front side (21) over a first length (L1) along said longitudinal axis (20). The shielding cage (6) contains a sheet metal section (8) extending from said rear side (20) towards said front side (21) over a second length (L2) along said longitudinal axis (20), said first length (LI) being substantially shorter than said second length (L2). The shielding cage (6) combines a considerable degree of freedom in shaping and robustness at the diecast front side (7) with a substantial reduction of the temperature induced stresses as the length of the diecast section (7) is substantially shorter than that of the second shield metal section (8) of the cage (6).
Abstract:
An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.
Abstract:
A shield is described for minimizing leakage of electromagnetic waves from a connector/chassis interface. The shield includes a conductive strip sized to at least partially surround an aperture in a chassis, where the chassis receives a connector port assembly through the aperture. The conductive strip includes an outer portion affixed to an interior surface of the chassis, and an inner portion able to be manipulated to at least partially cover one or more gaps between the connector port assembly and the chassis.
Abstract:
A connector can include a first shell having at least one first wall made of an electrically conductive material, where the at least one first wall forms a first cavity. The connector can also include an insert disposed within the first cavity. The connector can further include at least one connector pin disposed in and traversing the first shell. The connector can also include an electrically conductive face seal that abuts against a distal end of the insert within the first cavity, where the at least one connector pin traverses at least one first aperture in the electrically conductive face seal. The connector can further include at least one electrically insulating bushing disposed within the at least one first aperture in the electrically conductive face seal, where the at least one electrically insulating bushing is further disposed between the face seal and the at least one connector pin.
Abstract:
The invention relates to a medium voltage connection, comprising: -a firstconductor and a second conductor electrically attached to each other; -a first isolating layer arranged around the first conductor and a second isolating layer arranged around the second conductor, leaving an airgap between both isolating layers; -an isolating rubber sleeve arranged between the first isolating layer and the second isolating layer to fill the airgap between the two isolating layers; wherein -a conducting layer is arranged on the first isolating layer; and wherein -the rubber sleeve is provided with a conducting portion, which overlaps with the conducting layer.