Abstract:
Disclosed is an acetylenic polyamide and a composition comprising said acetylenic polyamide, which acetylenic polyamide. Said acetylenic group is suitably obtained by subjecting at least one acetylenic compound to reaction with either at least one polyamide, or at least one amino functional monomer and/or carboxylic acid, yielding a corresponding acetylenic amide monomer, oligoamide or polyamide. Amide monomers and/or oligoamides can subsequently be used in production of the acetylenic polyamide.
Abstract:
Solvent-resistant polyamides having an exceptionally desirable combination of properties, including good cold flexibility, excellent impact resistance and high heat resistance are obtained by reacting a) an acid component comprising at least one C 6 to C 22 aliphatic dicarboxylic acid and b) an amine component comprising at least one alkylene diamine having from 2 to 14 carbon atoms, at least one polyoxyalkylene diamine containing at least one polyoxytetramethylene block, and at least one polyaxyalkylene diamine that does not contain a polyoxytetramethylene block. Such polyamides are particularly useful for molding and bonding applications, such as, for example, in the filter industry, especially articles that are to be used in applications involving organic solvents, fuels or oils.
Abstract:
Disclosed herein are the use as a thickener and surfactant of an associative polymer represented by formula 1, and a cosmetic composition containing the polymer as an active ingredient. More specifically, disclosed are the use as a thickener and surfactant of the associative polymer (formula 1), which is obtained by allowing a polyisocyanate compound represented by R 2 - (NCO) 2 to react with polyethylene glycol HO(CH 2 CH 2 O) n CH 2 CH 2 OH (n= 100-3000), and then allowing the reaction product to react with a monoalcohol represented by R 1 -OH, as well as the use of the associative polymer as a surfactant, and a cosmetic composition containing the associative polymer as an active ingredient. Because the associative polymer represented by formula 1 has hydrophilic and lipophilic groups, it can be used alone to prepare an emulsion. In addition, because the associative polymer can maintain viscosity even in conditions of various pHs and salts, the use of the associative polymer as an active ingredient makes it possible to prepare an excellent cosmetic composition, which is stable and shows no decrease in viscosity.
Abstract:
La présente invention concerne un polyamide et un procédé de fabrication de celui-ci et des compositions le contenant. Elle concerne plus particulièrement un polyamide obtenu par polymérisation de monomères diacides et diamines en présence de composés multifonctionnels et monofonctionnels capables de former une fonction amide par réaction soit avec une fonction aminé soit une fonction acide. Ce polyamide est notamment utile pour la fabrication de compositions destinées, par exemple, à être moulées.
Abstract:
Nitrocellulose-compatible laminating ink resin is prepared by reacting together reactants including polymerized fatty acid, co-diacid, monoacid, secondary diamine and C6 diamine, or reactive equivalents thereof. The resin may be used in printing compositions, and particularly printing compositions that also contains nitrocellulose, and that is useful in laminating printing onto plastic film.
Abstract:
The invention relates to a method for reducing the caprolactam content of polyamide 6 obtained especially by hydrolytic polymerization of epsilon-caprolactam. The method is characterized by the use of an additive that forms isocyanuric acid under the influence of heat. The additive or the isocyanuric acid produced externally under the influence of heat is added (a) to the polymerization or (b) to a melt of polyamide 6. This enables the caprolactam content of the polyamide 6 to be reduced considerably compared to that of usual commercial polyamide 6. In particular, the resulting polyamide 6 shows good characteristics for reprocessing e.g. into fibers and molding masses by melt extrusion.
Abstract:
The invention concerns concentrated solutions based on polyamide used for introducing an additive into a thermoplastic matrix. The concentrated solutions comprise a matrix and an additive, the matrix being a modified polyamide having a star-shaped or H-shaped structure.
Abstract:
A polyamide resin composition, characterized in that it exhibits a heat resistance temperature in reflow soldering of 250 DEG C or higher. The polyamide resin composition is reduced in water absorptivity and excellent in moldability, heat resistance, dimensional stability and mechanical strength, and thus can be suitably used for applications in automobile parts, electrical and electronic parts and the like.