Abstract:
Small-scale audio speakers of various shapes are installed in parent devices. Inner casings, and the surrounding vibration-damping zone often required between such casings and the surrounding parent-device walls, are omitted from the assembly. During integration with the parent device, each un-encased speaker and its signal lines are sealed into a single-walled enclosure that incorporates a parent-device wall as at least one side. The entire interior of the single-walled enclosure becomes a back volume for the speaker. The single-walled enclosure may incorporate seals at the speaker's audio-output aperture, at the pass-through for the signal lines, and at the interface between the parent-device wall(s) and the added side(s) constituting the single-walled enclosure. Optional adhesive-free sealing options include sliding tabs held by a snap-lock latch.
Abstract:
Speaker driver devices (1101) including a diaphragm (1102) and one or more electrode (1103) are provided herein. The diaphragms (1102) and electrodes (1103) of the speaker driver devices may each include carbon nanotubes and/or graphene. Also provided herein are methods of generating sound with such speaker driver devices.
Abstract:
Materials used in acoustic transducer membranes need very specific qualities that in any real system require many tradeoffs to be made. Graphene and graphene related materials are a newly discovered class of materials with some exceptional properties that offer the potential for significant contributions to the performance of many acoustical transduction systems. Accordingly the inventors have established graphene oxide based transducers as the basis of ribbon microphones and diaphragm loudspeakers using low cost manufacturing and processing techniques.
Abstract:
A PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate (S110); providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate (S120); providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer (S130); and releasing the sacrificial layer and the diaphragm layer remains (S140).
Abstract:
A silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate (3), wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm (1) on a silicon substrate (2); and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface (6) of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths (5) on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator.
Abstract:
본 발명은, 마이크로 스피커에 관한 것으로서, 프레임: 상기 프레임에 고정되는 요크와, 이러한 요크에 고정된 영구자석과, 상기 영구자석의 상면에 고정된 플레이트로 이루어진 자기회로부; 그 테두리는 상기 프레임에 고정되고, 그 가운데 부분은 관통되도록 형성된 진동판 바디; 상기 진동판 바디의 아래에 구비되고, 그 테두리는 상기 프레임에 고정되며, 상호 일체로 형성된 중심부와 주변부로 구성된 서스펜션; 상기 서스펜션의 하면에 고정되되, 상기 중심부와 주변부의 경계부분의 하면에 고정된 보이스 코일; 및 상기 프레임과 결합되는 커버;를 포함하여 구성된 것을 특징으로 한다. 본 발명에 의하면, 중심부를 일체로 구비한 서스펜션을 구비함으로써, 전기적으로 낮은 공진 주파수(Fo) 재생과 광범위하게 평탄한 주파수 특성을 가지는 마이크로 스피커를 얻을 수 있다는 효과를 얻을 수 있다.