Abstract:
Disclosed examples generally include methods and apparatuses related to microphone units, such as may be found in implantable medical devices (e.g., cochlear implants). Microphone units generally include a microphone element connected to a chamber having a concave floor with the chamber covered by a membrane. Microphone units can be configured to produce an output based on pressure waves (e.g., sound waves) that reach the membrane. In an example, a microphone unit has a pressurized gas within the chamber below the membrane such that, while in a static state, the membrane deflects away from the chamber floor.
Abstract:
A method of thinning a multilayer laminate material is provided to obtain a membrane stiffening plate (14) having a thickness less than currently known in the art. The multilayer laminate material comprises a middle layer (20) and two outer metal layers (16,18) that have been compressed without being subjected to heat. The method provides for a significant reduction in the thickness of a membrane stiffening plate and provides for a mechanism to tune the cut-off frequency of a loudspeaker on which the membrane stiffening plate is used.
Abstract:
The present invention relates to a miniature diaphragm assembly comprising a deep-drawn polymer foil forming a moveable membrane having an integrated suspension member and an integrated attachment region for attaching the diaphragm assembly to an outer surface of an associated receiver arrangement, said attachment region extending in a direction being essentially parallel to a direction of movement of the movable membrane.
Abstract:
L'invention concerne un dispositif de suspension pour haut-parleur comportant un bord extérieur (12) annulaire apte à fixer le dispositif de suspension avec un châssis (13), un bord intérieur (14) annulaire apte à fixer le dispositif de suspension avec une membrane (15), un arc de suspension (16) s'étendant annulairement entre les bords, ledit arc de suspension (16) étant apte à absorber des contraintes de déplacement produites sur le bord intérieur (14) au moyen d'une déformation formant ainsi au moins un mode de résonnance, l'arc de suspension (16) comportant au moins une excroissance (20) annulaire positionnée de sorte à minimiser l'au moins un mode de résonnance de l'arc de suspension (16),la masse de l'au moins une excroissance (20) annulaire étant comprise entre 150% et 400% de la masse d'une partie de l'arc de suspension (16) sur laquelle l'au moins une excroissance (20) annulaire est positionnée.
Abstract:
An integrated voice coil and cone assembly includes a cone assembly having a top diaphragm skin and a bottom diaphragm skin with a space between the top diaphragm skin and bottom diaphragm skin. The integrated voice coil and cone assembly also includes a voice coil configured to engage the cone assembly along a perimeter edge thereof, and an adhesive material placed between the top diaphragm skin and bottom diaphragm skin such that the adhesive material fills all of the space between the top and bottom diaphragm skins. The adhesive material also bonds the top diaphragm skin, bottom diaphragm skin, and voice coil into a single, integrated unit.
Abstract:
A speaker apparatus and an electronic device having the same are provided. The speaker apparatus includes a hollow shape frame, a magnet disposed in an internal part of the hollow shape frame, a voice coil installed in proximity to the magnet, a diaphragm including a diaphragm edge that vibrates by an electric current applied to the voice coil, and a diaphragm edge compression part extended upward along the diaphragm edge. The diaphragm edge compression part contacts an inner surface of a housing of the electronic device.
Abstract:
Providing a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate (1) to obtain an insulating layer (2) thereon and providing a metal layer (3) on the insulating layer (2); providing a sacrificial layer (4) on the metal layer (3); providing a first thermal bimorph layer (5) on the sacrificial layer (4); providing a second thermal bimorph layer (6) on the first thermal bimorph layer (5); providing a metal connecting layer (7) at the positions on the metal layer (3) where the sacrificial layer (4) is not provided; forming corresponding back holes (16) on the substrate (1) and the insulating layer (2) and releasing the sacrificial layer (4); forming a warped thermal bimorph diaphragm with the first thermal bimorph layer (5) and the second thermal bimorph layer (6) after the sacrificial layer (4) is released. With the MEMS speaker with thermal bimorphs, the problems of high production cost, complicated wafer process and limitations on sound performance improvements are solved.