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    ENCAPSULATION OF SENSING DEVICE
    1.
    发明申请
    ENCAPSULATION OF SENSING DEVICE 审中-公开

    公开(公告)号：WO2019043010A1

    公开(公告)日：2019-03-07

    申请号：PCT/EP2018/073145

    申请日：2018-08-28

    Applicant: INDIGO DIABETES NV

    Inventor： ORDONEZ ORELLANA, Juan Sebastian ,  ESPEEL, Pieter

    IPC: B81C1/00

    CPC classification number: B81C1/00309 ,  B81B2203/0127 ,  B81C2203/0154

    Abstract: In a first aspect, the present invention relates to a method for encapsulating a sensing and/or actuator device (100), comprising providing a sensing and/or actuator device (100) having a demarcation structure (400) thereon, the sensing and/or actuator device (100) comprising at least a substrate (200) and a sensing and/or actuator element (310) on the substrate (200), the demarcation structure (400) contacting the substrate (200) and defining an enclosed area (450) of the substrate (200), the enclosed area (450) comprising at least the sensing and/or actuator element (310). The method also comprises providing an encapsulation material (500) outside the enclosed area (450), such that the sensing and/or actuator element (310) is left uncovered by the encapsulation material (500). The demarcation structure (400) further comprises a capping structure (420) overlaying the sensing and/or actuator element (310).

    ANCHOR TRACKING APPARATUS FOR IN-PLANE ACCELEROMETERS AND RELATED METHODS
    3.
    发明申请
    ANCHOR TRACKING APPARATUS FOR IN-PLANE ACCELEROMETERS AND RELATED METHODS 审中-公开
    用于平面内加速度计的锚定跟踪装置和相关方法

    公开(公告)号：WO2018026677A1

    公开(公告)日：2018-02-08

    申请号：PCT/US2017/044581

    申请日：2017-07-31

    Applicant: ANALOG DEVICES, INC.

    Inventor： ZHANG, Xin ,  CLARK, William, A. ,  JUDY, Michael

    IPC: G01P15/125 ,  G01P15/18

    CPC classification number: G01P15/125 ,  B81B2201/0235 ,  B81B2203/0127 ,  G01P15/18 ,  G01P2015/084

    Abstract: A microelectromechanical systems (MEMS) accelerometer is described. The MEMS accelerometer may comprise a proof mass configured to sense accelerations in a direction parallel the plane of the proof mass, and a plurality of compensation structures. The proof mass may be connected to one or more anchors through springs. The compensation structures may be coupled to the substrate of the MEMS accelerometer through a rigid connection to respective anchors. A compensation structure may comprise at least one compensation electrode forming one or more lateral compensation capacitors. The compensation capacitor(s) may be configured to sense displacement of the anchor to which the compensation structures is connected.

    Abstract translation: 描述了微机电系统（MEMS）加速度计。 MEMS加速度计可以包括检测质量块和多个补偿结构，检测质量块被配置为感测平行于检测质量块的平面的方向上的加速度。 检测质量可以通过弹簧连接到一个或多个锚。 补偿结构可以通过刚性连接到相应的锚固件而被耦合到MEMS加速计的衬底。 补偿结构可以包括形成一个或多个横向补偿电容器的至少一个补偿电极。 补偿电容器可以被配置为感测补偿结构连接到的锚的位移。

    MEMS-BAUELEMENT
    7.
    发明申请
    MEMS-BAUELEMENT 审中-公开
    MEMS组件

    公开(公告)号：WO2016030040A1

    公开(公告)日：2016-03-03

    申请号：PCT/EP2015/064042

    申请日：2015-06-23

    Applicant: ROBERT BOSCH GMBH

    Inventor： STUMBER, Michael ,  STEIN, Benedikt ,  SCHELLING, Christoph

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81B3/0086 ,  B81B2201/01 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81C1/00801

    Abstract: Es wird ein Schichtmaterial vorgeschlagen, das für die Realisierung von freitragenden Strukturelementen (31) mit Elektrode (7) im Schichtaufbau eines MEMS-Bauelements (102) besonders gut geeignet ist. Erfindungsgemäß soll das freitragende Strukturelement (31) zumindest teilweise aus einer Siliziumcarbonitrid (Si 1-x-y C x N y )-basierten Schicht bestehen.

    Abstract translation: 提出了一种片材，其是特别适合于悬臂的结构元件（31）与在MEMS器件（102）的层结构的电极（7）的实施。 根据本发明，自支撑的结构元件（31）以至少部分地由来自硅碳氮化物（1的Si-X-yCxNy）层为基础的。

    FULLY WAFER-LEVEL-PACKAGED MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    FULLY WAFER-LEVEL-PACKAGED MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    完全水平包装的MEMS麦克风及其制造方法

    公开(公告)号：WO2016029365A1

    公开(公告)日：2016-03-03

    申请号：PCT/CN2014/085222

    申请日：2014-08-26

    Applicant: GOERTEK INC.

    Inventor： ZOU, Quanbo ,  WANG, Zhe

    IPC: H04R19/04 ,  B81B7/00

    CPC classification number: H04R19/005 ,  B81B3/001 ,  B81B7/00 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/012 ,  B81C1/0023 ,  B81C2203/0118 ,  B81C2203/058 ,  B81C2203/0785 ,  H04R19/04 ,  H04R31/00 ,  H04R31/006 ,  H04R2201/003

    Abstract: A method for manufacturing a fully wafer-level-packaged MEMS microphone and a microphone manufactured with the same are provided, the method comprises: separately manufacturing a first packaging wafer, an MEMS microphone wafer and a second packaging wafer; performing wafer-to-wafer bonding for the three wafers to form a plurality of fully wafer-level-packaged MEMS microphone units; singulating the fully wafer-level-packaged MEMS microphone units to form a plurality of fully wafer-level-packaged MEMS microphones, which are fully packaged at wafer level and do not need any further process after die singulation. The method can improve cost-effectiveness, performance consistency, manufacturability, quality, scaling capability of the packaged MEMS microphone.

    Abstract translation: 提供了一种用于制造全晶片级封装的MEMS麦克风和由其制造的麦克风的方法，该方法包括：分别制造第一封装晶片，MEMS麦克风晶片和第二封装晶片; 对三个晶片执行晶片到晶片接合以形成多个完全晶片级封装的MEMS麦克风单元; 将全部晶圆级封装的MEMS麦克风单元分开，以形成多个完全晶片级封装的MEMS麦克风，其在晶片级完全封装，并且在单片化之后不需要任何进一步的处理。 该方法可以提高封装的MEMS麦克风的成本效益，性能一致性，可制造性，质量，扩展能力。

    PCB SPEAKER AND METHOD FOR MICROMACHINING SPEAKER DIAPHRAGM ON PCB SUBSTRATE
    9.
    发明申请
    PCB SPEAKER AND METHOD FOR MICROMACHINING SPEAKER DIAPHRAGM ON PCB SUBSTRATE 审中-公开
    印刷电路板扬声器和印刷电路板基板上的扬声器胶片的方法

    公开(公告)号：WO2016029359A1

    公开(公告)日：2016-03-03

    申请号：PCT/CN2014/085207

    申请日：2014-08-26

    Applicant: GOERTEK INC.

    Inventor： ZOU, Quanbo

    IPC: H04R19/02 ,  H04R7/14

    CPC classification number: H04R31/003 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2201/019 ,  H04R1/06 ,  H04R7/04 ,  H04R7/14 ,  H04R19/005 ,  H04R19/02 ,  H04R31/00 ,  H04R2201/003 ,  H04R2499/11

    Abstract: A PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate (S110); providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate (S120); providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer (S130); and releasing the sacrificial layer and the diaphragm layer remains (S140).

    Abstract translation: 一种PCB扬声器和用于在PCB基板上微加工扬声器振膜的方法，用于在PCB基板上微加工扬声器振动膜的方法包括：在PCB基板上提供金属通路和至少一个通孔（S110）; 在所述PCB衬底上提供图案化牺牲层，所述牺牲层覆盖所述PCB衬底上的所有通孔（S120）; 通过沉积，安装或层叠覆盖牺牲层并与PCB衬底上的金属路径电连接的隔膜层在牺牲层上提供隔膜层，从而形成隔膜层（S130）; 并释放牺牲层和隔膜层（S140）。

    SILICON SPEAKER
    10.
    发明申请
    SILICON SPEAKER 审中-公开
    硅胶扬声器

    公开(公告)号：WO2016029358A1

    公开(公告)日：2016-03-03

    申请号：PCT/CN2014/085206

    申请日：2014-08-26

    Applicant: GOERTEK INC.

    Inventor： ZOU, Quanbo

    IPC: H04R7/14 ,  H04R19/02

    CPC classification number: H04R19/005 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00158 ,  H04R7/14 ,  H04R19/02 ,  H04R2201/003

    Abstract: A silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate (3), wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm (1) on a silicon substrate (2); and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface (6) of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths (5) on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator.

    Abstract translation: 一种包括MEMS声电芯片和PCB基板（3）的硅扬声器，其中所述MEMS声电芯片包括在硅衬底（2）上的波纹膜片（1）; 并且MEMS声电芯片的一个侧表面被金属化，并且MEMS声电芯片的金属化侧表面（6）与PCB衬底连接。 波纹膜片是导电的并且与MEMS声电芯片上的金属路径（5）互连，其被引导到作为一个电极的第一PCB金属路径。 MEMS芯片下面的第二个PCB金属通道形成静电致动器的另一个电极。

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