公开(公告)号：WO2018207177A1

公开(公告)日：2018-11-15

申请号：PCT/IL2018/050494

申请日：2018-05-07

Applicant: PRINTCB LTD.

Inventor： KARNI, Yiftah ,  DAREN, Sagi

IPC: B23K35/22 ,  B23K35/362 ,  H01R4/02 ,  H01R4/04 ,  H05K3/34

CPC classification number: H01R4/02 ,  B22F1/0003 ,  B22F3/008 ,  B22F7/064 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  H01R4/04 ,  H01R43/0242 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2203/047

Abstract: The present invention provides a method for connecting metallic surfaces with a metal- based adhesive film, the method utilizing successive application and heating of two distinct compositions comprising metal or metal alloy powders having different melting points. Further provided is a kit for attaching metallic surfaces, the kit containing two distinct metal-based compositions. Further disclosed is an assembly of two electronic or semiconductor components comprising a continuous metal-based adhesive film there between.

公开(公告)号：WO2016166751A1

公开(公告)日：2016-10-20

申请号：PCT/IL2016/050382

申请日：2016-04-12

Applicant: PRINTCB LTD.

Inventor： KARNI, Yiftah ,  DAREN, Steve

IPC: H05K3/46 ,  H05K1/09 ,  H05K3/40 ,  H01B1/22 ,  H01L23/498 ,  H01L23/532

CPC classification number: H01L21/4867 ,  H01B1/20 ,  H01B1/22 ,  H01L23/488 ,  H01L23/49883 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/4664 ,  H05K3/4673 ,  H05K3/4679 ,  H05K3/4682 ,  H05K2201/0272 ,  H05K2203/0126

Abstract: A sheet-fed system designed to print multilayer PCBs is introduced. The system consists of four main blocks; a drilling station, a patterning station, a stacking/bonding station, and a sintering zone. The substrate PCB is shuttled between these various stations, to have vias drilled, to be attached to stacks of previously-processed layers, to be covered with conductive paths by means of the aforementioned ink, and to have the ink sintered under a controlled temperature and atmosphere. Patterning is accomplished by means of a novel two-step method involving both high-temperature conductive elements, low- temperature conductive elements, and flux. Two such compositions are successively applied and individually sintered to form a single conductive path; the second application serves to fill the porosities of the first layer. By this method, a highly-conductive trace is obtained without requiring high temperatures, which in turn allows use of common substrates including polymers.

Abstract translation: 介绍了一种设计用于印刷多层PCB的单张纸系统。 该系统由四个主要块组成; 钻孔站，图案化站，堆叠/粘合站以及烧结区。 衬底PCB穿梭在这些各个工位之间，以便通过钻孔的通孔被连接到预先处理的层的堆叠上，以便通过上述油墨被导电路径覆盖，并使油墨在受控的温度下烧结， 大气层。 图案化是通过包括高温导电元件，低温导电元件和焊剂两者的新颖的两步法完成的。 连续地施加两种这样的组合物并单独地烧结以形成单个导电路径; 第二个应用程序用于填充第一层的孔隙率。 通过这种方法，可以获得高导电性的痕迹，而不需要高温，这又允许使用包括聚合物在内的普通基底。