Abstract:
A cooled light emitting apparatus (1) comprises a light source including a close packed array (2) of light emitting diode devices (high intensity LEDs) and a cooling system for cooling the light source. The cooling system comprises a thermoelectric cooling device in the form of a Peltier device (4) connected via a heat spreader (3) to the light source and a heat exchange system (5, 6) for removing heat from the Peltier device (4). The heat exchange system (5, 6) uses liquid coolant (or refrigerant) to cool the Peltier device (4). By extracting heat from the LED array (2) at a rate greater than 5W cm -2 it is possible to maintain the LED array at a temperature of less than -10 degrees Celsius, and thus emit light having an optical power density of greater than 1Wcm -2 .
Abstract:
A modifying structure lens (1) is formed over a LED light source (2) so as to act to focus the light into the appropriate configuration (ray direction) and simultaneously extract heat from the upper and side surface of the LED chip (2). The LED light source (2) is mounted to a rear heat sink body (4). The lens (1) comprises a primary region (5) immediately adjacent the LED source (2) (and within which the LED source (2) is embedded). The primary region (5) includes a diamond compound particulate material distributed throughout a flexible gel matrix, as will be described in detail hereafter. An overlaying layer (6) of a light transparent material is not impregnated with the diamond compound material.
Abstract:
An LED array and a method for controlling such an array is described. The array includes one or more LED-optical sensor pairs in which the optical sensor measures the light output of the associated LED. In some forms of the invention, the optical sensors are provided with filters to attenuate light at a wavelength different to that of the LED associated with that optical sensor. In some forms of the invention, the LED-optical sensor pairs are at least partially shielded from extraneous light. In one form of the invention a plurality of sets of LEDs is provided, each set outputting light having a different frequency and each set being controllable to provide a desired light output.
Abstract:
A method and apparatus for cooling an electronic component, such as an optoelectronic device, is described. The method involves arranging a porous material to be able to receive heat from the electronic component and removing heat from the porous material as a result of vaporisation of a coolant delivered to the porous material. In this manner, a temperature gradient is generated that causes heat to flow from the electronic device to the porous material, resulting in the electronic device being cooled.
Abstract:
A method and apparatus for improving the cosmetic appearance of a region of skin (11) affected by Acne Vulgaris, Rosacea or similar skin condition by means of directing light radiation (12) from an illuminating device (1) on to the skin (11). The apparatus (10) comprises a control unit (9) that operates one or more LEDs (7) (light emitting diodes) of the illuminating device (1). Each dose of light radiation (12) lasts for at least 100ms, during which time the skin 11 receives light energy from the LED(s) (7), which causes a photochemical reaction that stimulates the production of free radicals (singlet oxygen) that react with, and at least partially disable or destroy, bacteria that contribute to the symptoms of the skin condition. The light energy directed on to the skin (11) during any given period of 10µs is less than 0.5 Jcm 2 , and during any given period of 100ms is less than 5 Jcm -2 . Substantially no beneficial photo-thermal reaction occurs within the skin (11). Light having wavelengths around 405nm and/or 585nm is used. The duration of a single dose may be much longer than 100ms and can last up to 10 hours (for overnight treatment).
Abstract:
A light emitting semiconductor device (10) mounted on a heat sink (16) and having a heat pipe (18) located on its upper surface (12). The heat pipe (18) comprises a sealed cylindrical member of transparent or translucent material having a wick (20) disposed down the side and along the bottom thereof. The heat (18) is partially filled with a liquid which is placed under a partial vacuum to reduce its boiling point. A bundle of optical fibres may be provided within the heat pipe (18), with the gaps created between the optical fibres providing an efficient capillary action within the heat pipe (18) for transport of vapour to the cool end of the pipe (18) and for transport of condensed coolant to the hot end of the pipe (18).
Abstract:
A light emitting semiconductor device (10) mounted on a heat sink (16) and having a heat pipe (18) located on its upper surface (12). The heat pipe (18) comprises a sealed cylindrical member of transparent or translucent material having a wick (20) disposed down the side and along the bottom thereof. The heat (18) is partially filled with a liquid which is placed under a partial vacuum to reduce its boiling point. A bundle of optical fibres may be provided within the heat pipe (18), with the gaps created between the optical fibres providing an efficient capillary action within the heat pipe (18) for transport of vapour to the cool end of the pipe (18) and for transport of condensed coolant to the hot end of the pipe (18).
Abstract:
A cooled light emitting apparatus 1 comprises a light source including a close packed array 2 of light emitting diode devices (high intensity LEDs) and a cooling system for cooling the light source. The cooling system comprises a thermoelectric cooling device in the form of a Peltier device 4 connected via a heat spreader 3 to the light source and a heat exchange system 5, 6 for removing heat from the Peltier device 4. The heat exchange system 5,6 uses liquid coolant (or refrigerant) to cool the Peltier device 4. By extracting heat from the LED array 2 at a rate greater than 5W cm -2 it is possible to maintain the LED array at a temperature of less than -10 degrees Celsius, and thus emit light having an optical power density of greater than 1Wcm -2 .
Abstract translation:冷却发光装置1包括光源,其包括发光二极管装置(高强度LED)的紧密堆积阵列2和用于冷却光源的冷却系统。 冷却系统包括通过散热器3连接到光源的珀耳帖装置4形式的热电冷却装置和用于从珀耳帖装置4去除热量的热交换系统5,6。热交换系统5,6 使用液体冷却剂(或制冷剂)来冷却珀耳帖装置4.通过以大于5W cm -2的速率从LED阵列2提取热量,可以将LED阵列保持在小于-10度的温度 摄氏度,因此发光的光功率密度大于1Wcm -2。
Abstract:
A modifying structure lens (1) is formed over a LED light source (2) so as to act to focus the light into the appropriate configuration (ray direction) and simultaneously extract heat from the upper and side surface of the LED chip (2). The LED light source (2) is mounted to a rear heat sink body (4). The lens (1) comprises a primary region (5) immediately adjacent the LED source (2) (and within which the LED source (2) is embedded). The primary region (5) includes a diamond compound particulate material distributed throughout a flexible gel matrix, as will be described in detail hereafter. An overlaying layer (6) of a light transparent material is not impregnated with the diamond compound material.
Abstract:
The present invention relates to a food heating arrangement which cooks food using the Sous Vide process. The present invention is a food heating apparatus which comprises a liquid reservoir for containing a heated liquid and a liquid distributing rotary device. A good stuff receiving zone is provided for receipt of a food and the liquid distributing rotary device displaces liquid from a liquid reservoir towards the food stuff receiving zone. This provides control of cooking of the food stuff and reduces the volume of liquid needed to be heated.