公开(公告)号：WO2004017687A1

公开(公告)日：2004-02-26

申请号：PCT/EP2003/012647

申请日：2003-04-18

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  COMPAGNIE IBM FRANCE ,  CASTRIOTTA, Michele ,  OGGIONI, Stefano ,  ROGIANI, Gianluca ,  SPREAFICO, Mauro ,  VIERO, Giorgio

发明人： CASTRIOTTA, Michele ,  OGGIONI, Stefano ,  ROGIANI, Gianluca ,  SPREAFICO, Mauro ,  VIERO, Giorgio

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/15173 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/0979 ,  H01L2924/00

摘要： A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis. In a preferred embodiment, the shape of these aligned conductive tracks looks like a disk or an annular ring and four vias are used to connect two adjacent conductive layers. These four vias are symmetrically disposed on each of said conductive track. The position of the vias between a first and a second adjacent conductive layers and between a second and a third adjacent conductive layers forms an angle of 45° according to z axis.

摘要翻译： 公开了一种适于通过电子设备载体的导电层传输高频信号或高强度电流的堆叠通孔结构（200）。 叠置的通孔结构包括属于根据z轴排列的电介质层（120）分开的三个相邻导电层（110a，110b，110c）的至少三个导电轨道（205a，205b，205c）。 这些导电轨道之间的连接通过在每个导电层之间的至少两个通孔（210,215）进行。 连接到导电轨道的一侧的通孔布置成使得它们不与根据z轴连接到另一侧的那些对准。 在优选实施例中，这些对准的导电轨迹的形状看起来像盘或环形环，并且四个通孔用于连接两个相邻的导电层。 这四个通孔对称地设置在每个导电轨道上。 在第一和第二相邻导电层之间以及第二和第三相邻导电层之间的通孔的位置根据z轴形成45°的角度。

公开(公告)号：WO2005058748A1

公开(公告)日：2005-06-30

申请号：PCT/EP2004/052846

申请日：2004-11-08

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION ,  COMPAGNIE IBM FRANCE ,  ALBRECHT, Thomas ,  CASTRIOTTA, Michele ,  DESPONT, Michel ,  LANTZ, Mark ,  OGGIONI, Stefano

发明人： ALBRECHT, Thomas ,  CASTRIOTTA, Michele ,  DESPONT, Michel ,  LANTZ, Mark ,  OGGIONI, Stefano

IPC分类号： B81B7/00

CPC分类号： B81C3/002 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/2036 ,  H05K2203/048 ,  Y02P70/613

摘要： A method and system for efficiently self-aligning parts of a MEMS during manufacturing, as well as controlling distance between these parts, are disclosed. According to the invention each MEMS part comprises at least one pad that is aligned so as to form a pair of pads. In a preferred embodiment, each part comprises three pads. The pad shape of two pairs of pads is rectangular, one pair being rotated of an angle approximately equal to 90° from the other, and the pad shape of the third pair is annular. Therefore, one of the pair of pads allows alignment according to a first direction, a second pair of pads allows alignment according to a second direction, and the third pair of pads allows rotational alignment.

摘要翻译： 公开了一种用于在制造期间有效地对准MEMS部件的方法和系统，以及控制这些部件之间的距离。 根据本发明，每个MEMS部件包括至少一个对准以形成一对焊盘的焊盘。 在优选实施例中，每个部分包括三个焊盘。 两对焊盘的焊盘形状是矩形的，一对由另一对旋转大约等于90°的角度，第三对的焊盘形状是环形的。 因此，一对衬垫之一允许根据第一方向进行对准，第二对衬垫允许根据第二方向对准，并且第三对衬垫允许旋转对准。