公开(公告)号：WO2019066992A1

公开(公告)日：2019-04-04

申请号：PCT/US2017/054676

申请日：2017-09-30

Applicant: INTEL CORPORATION ,  EID, Feras ,  SWAN, Johanna M. ,  CHAN ARGUEDAS, Sergio ,  BEATTY, John J.

Inventor： EID, Feras ,  SWAN, Johanna M. ,  CHAN ARGUEDAS, Sergio ,  BEATTY, John J.

IPC: H01L23/367 ,  H01L23/40

Abstract: A device package and a method of forming a device package are described. The device package has dies disposed on a substrate, and one or more layers with a high thermal conductivity, referred to as the highly-conductive (HC) intermediate layers, disposed on the dies on the substrate. The device package further includes a lid with legs on an outer periphery of the lid, a top surface, and a bottom surface. The legs of the lid are attached to the substrate with a sealant. The bottom surface of the lid is disposed over the one or more HC intermediate layers and the one or more dies on the substrate. The device package may also include thermal interface materials (TIMs) disposed on the HC intermediate layers. The TIMs may be disposed between the bottom surface of the lid and one or more top surfaces of the HC intermediate layers.

公开(公告)号：WO2018182756A1

公开(公告)日：2018-10-04

申请号：PCT/US2017/025664

申请日：2017-04-01

Applicant: INTEL CORPORATION ,  MANI, Divya ,  LAMBERT, William J. ,  LIFF, Shawna ,  CHAN ARGUEDAS, Sergio A. ,  SANKMAN, Robert L.

Inventor： MANI, Divya ,  LAMBERT, William J. ,  LIFF, Shawna ,  CHAN ARGUEDAS, Sergio A. ,  SANKMAN, Robert L.

IPC: H05K1/02 ,  H01L23/36 ,  H05K3/34 ,  H04B1/40

Abstract: Embodiments of the invention include a mmWave transceiver and methods of forming such devices. In an embodiment, the mmWave transceiver includes an RF module. The RF module may include a package substrate, a plurality of antennas formed on the package substrate, and a die attached to a surface of the package substrate. In an embodiment, the mmWave transceiver may also include a mainboard mounted to the RF module with one or more solder balls. In an embodiment, a thermal feature is embedded within the mainboard, and the thermal feature is separated from the die by a thermal interface material (TIM) layer. According to an embodiment, the thermal features are slugs and/or vias. In an embodiment, the die compresses the TIM layer resulting in a TIM layer with minimal thickness.