公开(公告)号：WO1998002921A1

公开(公告)日：1998-01-22

申请号：PCT/US1997012044

申请日：1997-07-11

Applicant: KOPIN CORPORATION ,  VU, Duy-Phach ,  DINGLE, Brenda ,  CHEONG, Ngwe, K. ,  JACOBSEN, Jeffrey ,  FAN, John, C., C.

Inventor： KOPIN CORPORATION

IPC: H01L23/538

CPC classification number: H01L21/568 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/50 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K1/16 ,  H05K3/20 ,  H01L2924/00

Abstract: Integrated circuits for use in electronic devices requiring high density packaging are fabricated to provide highly flexible and ultra-thin devices having a variety of applications. The flexible circuits have dimensions up to several centimeters in surface area and thicknesses of a few microns. These circuits are fabricated using transfer techniques which include the removal of VLSI circuits from silicon wafers and mounting of the circuits on application-specific substrates.

Abstract translation: 制造用于需要高密度封装的电子器件的集成电路被制造以提供具有各种应用的高度灵活和超薄的器件。 柔性电路的表面积可达几厘米，厚度几微米。 这些电路使用转移技术制造，其包括从硅晶片去除VLSI电路并且将电路安装在特定应用的衬底上。