公开(公告)号：WO2012030420A3

公开(公告)日：2012-04-26

申请号：PCT/US2011037905

申请日：2011-05-25

Applicant: NAT SEMICONDUCTOR CORP ,  DARBINYAN ARTUR ,  SINCERBOX KURT E ,  CHIN DAVID T

Inventor： DARBINYAN ARTUR ,  SINCERBOX KURT E ,  CHIN DAVID T

IPC: H05K5/06 ,  H01L23/02

CPC classification number: H05K5/064

Abstract: Methods and arrangements for packaging system level electronics are described. In one aspect, an external skin of the package is formed from isolation paper. In some embodiments, the isolation paper is formed into a box. A printed circuit board is placed within the isolation paper skin and is substantially completely surrounded by a potting material that substantially completely fills the skin. The potting material is cured to solidify the potting material within the isolation paper box and to adhere the potting material to the isolation paper such that the isolation paper forms a skin for a brick of potting material that encapsulates the printed circuit board. The isolation paper skin includes at least one opening that permits an interconnect to be exposed through the skin. With this arrangement, a packaged electronics device is provided and the isolation paper forms the exposed outer surface of the packaged electronics device. The described package is particularly well suited for use in packaging system level power electronics such as power supplies.

Abstract translation: 描述了包装系统级电子设备的方法和布置。 在一个方面，包装的外表皮由隔离纸形成。 在一些实施例中，隔离纸形成盒子。 印刷电路板被放置在隔离纸皮内并且基本完全被基本上完全填充皮肤的灌封材料包围。 灌封材料被固化以固化隔离纸盒内的灌封材料并且将灌封材料粘附到隔离纸上，使得隔离纸形成用于封装印刷电路板的灌封材料砖的表皮。 隔离纸表皮包括至少一个允许互连通过皮肤暴露的开口。 利用这种布置，提供封装的电子设备，并且隔离纸形成封装的电子设备的暴露的外表面。 所描述的封装特别适合用于封装系统级功率电子器件，例如电源。

公开(公告)号：WO2012030420A2

公开(公告)日：2012-03-08

申请号：PCT/US2011/037905

申请日：2011-05-25

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  DARBINYAN, Artur ,  SINCERBOX, Kurt, E. ,  CHIN, David, T.

Inventor： DARBINYAN, Artur ,  SINCERBOX, Kurt, E. ,  CHIN, David, T.

IPC: H05K5/06 ,  H01L23/02

CPC classification number: H05K5/064

Abstract: Methods and arrangements for packaging system level electronics are described. In one aspect, an external skin of the package is formed from isolation paper. In some embodiments, the isolation paper is formed into a box. A printed circuit board is placed within the isolation paper skin and is substantially completely surrounded by a potting material that substantially completely fills the skin. The potting material is cured to solidify the potting material within the isolation paper box and to adhere the potting material to the isolation paper such that the isolation paper forms a skin for a brick of potting material that encapsulates the printed circuit board. The isolation paper skin includes at least one opening that permits an interconnect to be exposed through the skin. With this arrangement, a packaged electronics device is provided and the isolation paper forms the exposed outer surface of the packaged electronics device. The described package is particularly well suited for use in packaging system level power electronics such as power supplies.

Abstract translation: 描述了包装系统级电子设备的方法和布置。 在一个方面，包装的外部皮肤由隔离纸形成。 在一些实施例中，隔离纸被形成为盒子。 印刷电路板放置在隔离纸皮肤内，并且基本上完全被基本上完全填充皮肤的灌封材料包围。 固化灌封材料以固化隔离纸箱内的灌封材料，并将灌封材料粘附到隔离纸上，使得隔离纸形成封装印刷电路板的灌封材料砖的表皮。 隔离纸皮肤包括允许互连通过皮肤暴露的至少一个开口。 利用这种布置，提供了封装的电子设备，并且隔离纸形成了封装的电子设备的暴露的外表面。 所描述的封装特别适用于封装系统级电力电子设备，如电源。

公开(公告)号：WO2010077394A1

公开(公告)日：2010-07-08

申请号：PCT/US2009/056693

申请日：2009-09-11

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  DARBINYAN, Artur ,  NGUYEN, Luu ,  PODDAR, Anindya

Inventor： DARBINYAN, Artur ,  NGUYEN, Luu ,  PODDAR, Anindya

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4232

Abstract: Optoelectronic packages and wafer level techniques for forming optoelectronic packages are described. In accordance with one apparatus aspect of the invention, a pair of substrates are bonded together to form an optical coupler. A first one of the substrates has a recess that faces the second substrate to at least in part define a channel suitable for receiving an optical transmission medium. A photonic device is mounted on a mounting surface of the second substrate that is opposite its bonded surface. The photonic device faces the reflective surface and an optical path is formed between the channel and the photonic element that both reflects off of the reflective surface and passes through the second substrate. In some embodiments an integrated circuit device and/or solder bumps are also attached to the mounting surface and the second substrate has conductive traces thereon that electrically couple the various electrical components as appropriate (e.g., the photonic device, the integrated circuit device, the solder bumps and/or other components). The substrates may be formed from a wide variety of materials including, glass, plastic and silicon. In some embodiments, at least the second substrate is formed from an optically transparent material and the optical path passes directly though the optically transparent material. In a method aspect of the invention, a variety of wafer level methods for forming such devices are described.

Abstract translation: 描述了用于形成光电封装的光电封装和晶片级技术。 根据本发明的一个装置方面，一对基板结合在一起以形成光耦合器。 基板中的第一个具有面向第二基板的至少部分地限定适于接收光传输介质的通道的凹槽。 光子器件安装在第二衬底的与其接合表面相对的安装表面上。 光子器件面向反射表面，并且在通道和光子元件之间形成光路，两者都从反射表面反射并穿过第二衬底。 在一些实施例中，集成电路器件和/或焊料凸块也附接到安装表面，并且第二衬底在其上具有导电迹线，其上适当地电耦合各种电气部件（例如，光子器件，集成电路器件，焊料 凸块和/或其他部件）。 基板可以由各种各样的材料形成，包括玻璃，塑料和硅。 在一些实施例中，至少第二衬底由光学透明材料形成，并且光路直接通过光学透明材料。 在本发明的方法方面，描述了用于形成这种装置的各种晶片级方法。