公开(公告)号：WO1992015408A1

公开(公告)日：1992-09-17

申请号：PCT/CH1992000035

申请日：1992-02-21

Applicant: DYCONEX PATENTE AG HEINZE & CO ,  SCHMIDT, Walter ,  MARTINELLI, Marco ,  FREI, Alexandra

Inventor： DYCONEX PATENTE AG HEINZE & CO

IPC: B07B01/46

CPC classification number: B07B1/4618 ,  B01D39/1692 ,  B01D67/0034 ,  B01D69/12 ,  B01D2323/345 ,  B07B1/4663 ,  G02B6/122 ,  G02B6/4228 ,  G02B6/423 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0041 ,  H05K3/42 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/09509 ,  H05K2203/0554

Abstract: In order to produce a specific microsieve having a large number of precisely arranged passages of whatever form, a plastic foil (1) is coated with a layer of etch-resistant material (2, 2'). Recesses (4, 4') are etched in this layer (2, 2') at the locations where passages are to be formed. In a further process step, the passages (5) are produced by a plasma etching process. In addition, ducts (K, L) are inserted into the coating layer (2, 2') either as channels (K) or as solid paths. Several microsieves (S1, S2) are superimposed to form a specific composite body, oriented in such a way that the ducts (5, K, L) are cross-linked in the x, y and z directions. Examples of applications are fluid-conducting diaphragms, electroconductive multilayers and cross-linked light-guide microsystems.

Abstract translation: 为了生产具有任何形式的大量精确布置的通道的特定微量筛，塑料箔（1）涂覆有一层抗蚀材料（2,2'）。 在要形成通道的位置，在该层（2,2'）中蚀刻凹槽（4,4'）。 在另外的工艺步骤中，通过等离子体蚀刻工艺制造通道（5）。 此外，管道（K，L）作为通道（K）或固体路径插入到涂层（2,2'）中。 叠加几个微通道（S1，S2）以形成一个特定的复合体，以使得管道（5，K，L）在x，y和z方向上交联的方式定向。 应用实例是导流隔膜，导电多层和交联光导微系统。