公开(公告)号：WO2007075435A2

公开(公告)日：2007-07-05

申请号：PCT/US2006047945

申请日：2006-12-14

Applicant: FLUENS CORP ,  DEVITO RICHARD ,  KLEIN MARTIN ,  SFERLAZZO PIERO

Inventor： DEVITO RICHARD ,  KLEIN MARTIN ,  SFERLAZZO PIERO

IPC: C23C14/00 ,  C23C14/32

CPC classification number: C23C14/0073 ,  C23C14/0052 ,  C23C14/044 ,  C23C14/35 ,  C23C14/46 ,  C23C14/568 ,  H01J37/185 ,  H01J37/3178 ,  H01J37/3233 ,  H01J37/32761 ,  H01J37/34 ,  H01J2237/2006 ,  H01J2237/202 ,  H01J2237/3146

Abstract: A reactive sputtering system includes a vacuum chamber and a reactive ion source that is positioned inside the vacuum chamber. The reactive ion source generates a reactive ion beam from a reactant gas. A sputtering chamber is positioned in the vacuum chamber. The sputtering chamber includes a sputter source having a sputtering target that generates sputtering flux, walls that contain an inert gas, and a seal that impedes the reactant gas from entering into the sputtering chamber and that impedes inert gas and sputtered material from escaping into the vacuum chamber. A transport mechanism transports a substrate under the reactive ion source and through the sputtering chamber. The substrate is exposed to the reactive ion beam while passing under the reactive ion source and then is exposed to sputtering flux while passing through the sputtering chamber.

Abstract translation: 反应性溅射系统包括真空室和位于真空室内的反应离子源。 反应离子源从反应气体产生反应离子束。 溅射室位于真空室中。 溅射室包括溅射源，其具有产生溅射焊剂的溅射靶，含有惰性气体的壁和阻止反应气体进入溅射室的密封件，并阻止惰性气体和溅射材料逸出到真空中 室。 输送机构将反应离子源下方的基板输送到溅射室。 当反应离子源通过时，将衬底暴露于反应离子束，然后在通过溅射室的同时暴露于溅射焊剂。