公开(公告)号：WO2010036790A1

公开(公告)日：2010-04-01

申请号：PCT/US2009/058197

申请日：2009-09-24

Applicant: ILLINOIS TOOL WORKS INC. ,  FORSYTH, Valoris, L. ,  LAWRENCE, Justin, L. ,  VANNORTWICK, John, E. ,  WANKE, Jamie, J. ,  CASEY, Christopher, E. ,  FORBIS, Michael, R. ,  STOOR, James, R. ,  SLAUGHTER, Michael, R.

Inventor： FORSYTH, Valoris, L. ,  LAWRENCE, Justin, L. ,  VANNORTWICK, John, E. ,  WANKE, Jamie, J. ,  CASEY, Christopher, E. ,  FORBIS, Michael, R. ,  STOOR, James, R. ,  SLAUGHTER, Michael, R.

IPC: G01R1/00

CPC classification number: H01L21/67356 ,  B29C45/0053 ,  B29C65/561 ,  B29C65/562 ,  B29C66/5346 ,  B29L2012/00 ,  B29L2031/737 ,  B65D1/34 ,  B65D25/10 ,  H01L21/67333 ,  H01L21/67369 ,  H01L21/67373

Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract translation: 本公开涉及用于处理和运送计算机芯片或类似的微电子器件的托盘。 托盘包括一系列通道，每个通道沿托盘的宽度延伸。 通道包括用于固定热成型带的销和夹子的装置。 热成型带包括用于存储各种计算机芯片或类似的微电子器件的口袋。