Abstract:
A stacking tray for electrical components, such as integrated circuit chips, particularly those of the ball grid array (BGA) type is disclosed. The tray is stackable and includes an upper side and a lower side. An array of storage pockets is formed between the upper side of a lower tray and the lower side of an upper tray. The storage pockets are separated by complementary support elements and further include a segmented pedestal arising from the center of the storage pocket, on the upper side of the trays. The segmented pedestal supports the integrated circuit chip, without interfering with the spherical balls. Moreover, the tray allows for variation of the dimensions of the integrated circuit chip while adequately stabilizing the chip.
Abstract:
The semiconductor wafer containment device or wafer box includes a base with a planar floor and a double concentric cylindrical wall structure arising therefrom. The double concentric cylindrical wall structure includes slots through which latch elements pivot radially. The latch elements include an inward padded spacer element. The latch elements pivot between an outward position wherein the padded spacer elements are relatively away from the wafer containment space and an inward upright position wherein the padded spacer elements impinge into the wafer containment space and are urged against the semiconductor wafers therein. Ramps on the lid capture the latch elements in the outward position and urge the latch elements to pivot to the inward upright position and be detent engaged in this position by slots formed on the lid.
Abstract:
The semiconductor wafer containment device or wafer box includes a base (10) with a planar floor (12) and a double concentric cylindrical wall structure (22, 24) arising therefrom. The double concentric cylindrical wall structure includes slots (26, 28) through which latch elements (44, 46) pivot radially. The latch elements include an inward padded spacer element (52, 53). The latch elements pivot between an outward position wherein the padded spacer elements are relatively away from the wafer containment space and an inward upright position wherein the padded spacer elements impinge into the wafer containment space and are urged against the semiconductor wafers therein. Ramps (77, 79) on the lid (70) capture the latch elements in the outward position and urge the latch elements to pivot to the inward upright position and be detent engaged in this position by slots (76, 78) formed on the lid.
Abstract:
The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.
Abstract:
The water-resistant or waterproof zipper includes first and second profiles which are interlocked or separated by the movement of a slider. The first sidewall of the slider is generally planar while the second sidewall is generally curved so that the sidewalls are relatively closer together at the closing end and generally further apart at the opening end. A triangular island and separating plow are formed at the opening end to separate the first and second profiles. The slider includes various channels which engage corresponding rails in the profiles in order to properly position the profiles. The slider further includes various protrusions and a flange to properly position the profiles.