公开(公告)号：WO2006078068A3

公开(公告)日：2007-02-01

申请号：PCT/JP2006301267

申请日：2006-01-20

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  KIHARA MASAHIRO ,  INOUE MASAFUMI ,  HIDESE WATARU

Inventor： KIHARA MASAHIRO ,  INOUE MASAFUMI ,  HIDESE WATARU

IPC: H05K13/08

CPC classification number: H05K13/0413 ,  H05K13/0069 ,  Y10T29/49004 ,  Y10T29/53174

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

公开(公告)号：WO2006078068A2

公开(公告)日：2006-07-27

申请号：PCT/JP2006/301267

申请日：2006-01-20

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  KIHARA, Masahiro ,  INOUE, Masafumi ,  HIDESE, Wataru

Inventor： KIHARA, Masahiro ,  INOUE, Masafumi ,  HIDESE, Wataru

IPC: H05K13/08

CPC classification number: H05K13/0413 ,  H05K13/0069 ,  Y10T29/49004 ,  Y10T29/53174

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子元件放置装置的元件放置步骤中，更新用于控制放置头32的元件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且防止由于基板的高度方向上的位置误差引起的安装故障。