公开(公告)号：WO2004063733A1

公开(公告)日：2004-07-29

申请号：PCT/JP2004/000064

申请日：2004-01-08

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  OKADA, Yasuichi ,  YAMASAKI, Kimiyuki ,  KIHARA, Masahiro

Inventor： OKADA, Yasuichi ,  YAMASAKI, Kimiyuki ,  KIHARA, Masahiro

IPC: G01N21/88

CPC classification number: G01N21/95684 ,  B23K1/0016 ,  B23K31/12 ,  B23K2201/40 ,  G01N21/8806 ,  G06K9/2036 ,  H05K1/0269 ,  H05K3/1233 ,  H05K3/3484

Abstract: In an image recognition method, the image of a cream solder 9 printed on a rectangular electrode 16 having a solder leveler formed is picked up and recognized to identify the cream solder 9. An illuminating unit having white light source parts 35W arranged in the radial oblique directions of 45 ° is used to apply white color illumination lights from a light applying direction in which an angle of θ 1 formed by the light applying direction and a horizontal plane in a vertical plane is 45 ° or smaller and from a light applying direction in which an angle of θ 3 formed by the light applying direction and the boundary of the electrode 16 in a horizontal plane is 75 ° or smaller. Thus, regularly reflected lights from a solder leveler forming surface 16a with a glossiness are not received by an upper camera to identify a solder surface 9a and the solder leveler forming surface 16a with good accuracy.

Abstract translation: 在图像识别方法中，拾取印刷在形成有焊料矫正机的矩形电极16上的膏状焊料9的图像，以识别出膏状焊料9.具有沿径向倾斜布置的白色光源部35W的照明单元 使用45°的方向从施加方向施加白色照明光，其中由照射方向形成的角度θ1和垂直平面中的水平面的角度为45°或更小，并且从 其中由光照射方向形成的θ3和水平面上的电极16的边界的角度为75°或更小的光施加方向。 因此，来自具有光泽度的焊料矫直机成形面16a的规则反射光不被上摄像机接收，以高精度地识别焊料表面9a和焊料矫正器形成表面16a。

公开(公告)号：WO2007119869A1

公开(公告)日：2007-10-25

申请号：PCT/JP2007/058475

申请日：2007-04-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  INOUE, Masafumi ,  TSUKAMOTO, Mitsuhaya ,  KIHARA, Masahiro ,  NISHI, Syoichi

Inventor： INOUE, Masafumi ,  TSUKAMOTO, Mitsuhaya ,  KIHARA, Masahiro ,  NISHI, Syoichi

IPC: H05K13/04

CPC classification number: H05K13/08 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/303 ,  H05K3/3484 ,  H05K13/0413 ,  H05K2203/0195 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53091 ,  Y10T29/53174

Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract translation: 在由多个电子部件安装装置形成的电子部件安装系统通过彼此连接构成安装电路板的电子部件安装工艺中，印刷在电路板上的焊膏位置的数据作为前馈传送 数据到电子元件放置装置和放置状态检查装置。 基于焊接位置数据，更新控制参数，该控制参数控制由于电子元件放置设备而导致的元件放置操作中的放置位置和指示在放置状态检查中的元件的标准位置的检查参数。 因此，可以通过有效且适当地使用从各处理获得的检查信息来实现精确的安装。

公开(公告)号：WO2006078068A2

公开(公告)日：2006-07-27

申请号：PCT/JP2006/301267

申请日：2006-01-20

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  KIHARA, Masahiro ,  INOUE, Masafumi ,  HIDESE, Wataru

Inventor： KIHARA, Masahiro ,  INOUE, Masafumi ,  HIDESE, Wataru

IPC: H05K13/08

CPC classification number: H05K13/0413 ,  H05K13/0069 ,  Y10T29/49004 ,  Y10T29/53174

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子元件放置装置的元件放置步骤中，更新用于控制放置头32的元件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且防止由于基板的高度方向上的位置误差引起的安装故障。

公开(公告)号：WO2007116848A1

公开(公告)日：2007-10-18

申请号：PCT/JP2007/057329

申请日：2007-03-26

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  NISHI, Syoichi ,  TSUKAMOTO, Mitsuhaya ,  KIHARA, Masahiro ,  INOUE, Masafumi

Inventor： NISHI, Syoichi ,  TSUKAMOTO, Mitsuhaya ,  KIHARA, Masahiro ,  INOUE, Masafumi

IPC: H05K13/04

CPC classification number: B23K31/12 ,  H01L2224/75 ,  H01L2224/81 ,  H01L2924/3511 ,  H05K1/0269 ,  H05K3/1216 ,  H05K3/3436 ,  H05K3/3484 ,  H05K13/0408 ,  H05K13/0465 ,  H05K13/08 ,  H05K2201/035 ,  H05K2201/10984 ,  H05K2203/0338 ,  H05K2203/163 ,  Y02P70/613

Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.

Abstract translation: 关于电子部件安装，其中具有在其下表面上具有用于外部连接的多个焊料凸块的电子部件安装在板上，在预先测量焊膏的焊膏的高度位置的电子部件安装操作中， 并且通过装载头将电子部件安装在印刷了焊锡膏的印刷电路板上，是否需要焊锡膏向焊料凸块的转印是否需要根据 锡膏的高度。 在判断需要进行转印的情况下，执行焊膏的转印，之后将电子部件安装在基板上。 因此，通过焊接将能够容易翘曲变形的薄型半导体封装安装在基板上的情况下，可以防止不良接合。

公开(公告)号：WO2006078000A2

公开(公告)日：2006-07-27

申请号：PCT/JP2006/300915

申请日：2006-01-17

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  KIHARA, Masahiro ,  INOUE, Masafumi

Inventor： KIHARA, Masahiro ,  INOUE, Masafumi

IPC: B23K3/00

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  H01L21/67282 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L2223/54473 ,  H01L2224/75 ,  H05K1/0269 ,  H05K3/0097 ,  H05K13/08 ,  H05K2203/163

Abstract: To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure. In the electronic component mounting method for mounting an electronic component on a multi-substrate in which a plurality of unit substrates are formed on the same substrate, the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates is determined by the test of the print state of the solder and a determination result is output to an electronic component placing device as solder test data in every unit substrate. In a component placing steps, a component placing mechanism is controlled based on the solder test data such that a component placing operation is performed only on the unit substrate in which the print state of the solder is determined to be good. Accordingly, it is possible to prevent waste due to the place of an electronic component onto a unit substrate having a print failure.

Abstract translation: 提供一种电子部件安装系统，电子部件放置装置和电子部件安装方法，其可以防止由于将电子部件放置在具有打印故障的单元基板上而引起的浪费。 在将电子部件安装在同一基板上形成多个单位基板的多基板上的电子部件安装方法中，印刷在形成于多个单位基板上的电极上的焊料的印刷状态的质量为 通过焊料的打印状态的测试来确定，并且将确定结果输出到电子部件放置装置作为每个单位基板中的焊接测试数据。 在部件放置步骤中，基于焊料测试数据来控制部件放置机构，使得仅在确定焊料的打印状态良好的单元基板上执行部件放置操作。 因此，可以防止由于电子部件的位置而导致在具有打印故障的单元基板上的浪费。

公开(公告)号：WO2006078068A3

公开(公告)日：2007-02-01

申请号：PCT/JP2006301267

申请日：2006-01-20

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  KIHARA MASAHIRO ,  INOUE MASAFUMI ,  HIDESE WATARU

Inventor： KIHARA MASAHIRO ,  INOUE MASAFUMI ,  HIDESE WATARU

IPC: H05K13/08

CPC classification number: H05K13/0413 ,  H05K13/0069 ,  Y10T29/49004 ,  Y10T29/53174

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Abstract translation: 提供一种能够防止由于基板的高度方向上的位置误差引起的安装故障并确保安装质量的电子部件安装系统和电子部件安装方法。 电子部件安装系统包括彼此连接的多个电子部件安装装置，并将电子部件安装在基板上以制造安装基板。 用于在焊接印刷之后测试基板的印刷测试装置通过高度测量机22测量设置在基板4的上表面上的高度测量点的高度位置，并输出测量结果作为基板高度数据。 在使用电子部件放置装置的部件放置步骤中，更新用于控制放置头32的部件放置操作的控制参数。 因此，可以校正单个基板的高度位置的变化，并且可以防止由于基板的高度方向上的位置误差引起的安装故障。

公开(公告)号：WO2007072981A1

公开(公告)日：2007-06-28

申请号：PCT/JP2006/325985

申请日：2006-12-20

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  INOUE, Masafumi ,  TSUKAMOTO, Mitsuhaya ,  NISHI, Syoichi ,  KIHARA, Masahiro

Inventor： INOUE, Masafumi ,  TSUKAMOTO, Mitsuhaya ,  NISHI, Syoichi ,  KIHARA, Masahiro

IPC: H05K13/04

CPC classification number: H05K13/08 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data. Then, once the substrate has been delivered to an electronic component placing apparatus, the substrate height measurement apparatus again measures the height of the substrate at specific height measurement points to obtain substrate height correction data, and based on the initial substrate height data and the substrate height correction data, updates a control parameter for controlling the component placing operation performed by a loading head. In this manner, discrepancies in the positions of the heights of individual substrates can be accurately corrected, and mounting defects due to positioning errors in the direction of the heights of the substrates can be prevented.

Abstract translation: 本发明的一个目的是提供一种电子部件安装系统和电子部件安装方法，其可以防止由于基板的厚度方向上的定位误差引起的安装缺陷，并且可以提供特定的安装质量。 根据通过连接多个用于安装电子部件的装置的电子部件安装系统，打印检查装置的高度测量装置22测量在基板的上表面上指定的高度测量点处的高度， 并输出测量结果作为衬底高度数据。 然后，一旦将基板输送到电子部件放置装置，基板高度测量装置再次测量特定高度测量点处的基板的高度，以获得基板高度校正数据，并且基于初始基板高度数据和基板 高度校正数据，更新用于控制由装载头执行的部件放置操作的控制参数。 以这种方式，可以精确地校正各个基板的高度位置的差异，并且可以防止由于在基板的高度方向上的定位误差而导致的安装缺陷。

公开(公告)号：WO2006078000A3

公开(公告)日：2007-02-08

申请号：PCT/JP2006300915

申请日：2006-01-17

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  KIHARA MASAHIRO ,  INOUE MASAFUMI

Inventor： KIHARA MASAHIRO ,  INOUE MASAFUMI

IPC: B23K3/00 ,  H05K13/00

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  H01L21/67282 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L2223/54473 ,  H01L2224/75 ,  H05K1/0269 ,  H05K3/0097 ,  H05K13/08 ,  H05K2203/163

Abstract: To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure. In the electronic component mounting method for mounting an electronic component on a multi-substrate in which a plurality of unit substrates are formed on the same substrate, the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates is determined by the test of the print state of the solder and a determination result is output to an electronic component placing device as solder test data in every unit substrate. In a component placing steps, a component placing mechanism is controlled based on the solder test data such that a component placing operation is performed only on the unit substrate in which the print state of the solder is determined to be good. Accordingly, it is possible to prevent waste due to the place of an electronic component onto a unit substrate having a print failure.

Abstract translation: 提供一种电子部件安装系统，电子部件放置装置和电子部件安装方法，其可以防止由于将电子部件放置在具有打印故障的单元基板上而引起的浪费。 在将电子部件安装在同一基板上形成多个单位基板的多基板上的电子部件安装方法中，印刷在形成于多个单位基板上的电极上的焊料的印刷状态的质量为 通过焊料的打印状态的测试来确定，并且将确定结果输出到电子部件放置装置作为每个单位基板中的焊接测试数据。 在部件放置步骤中，基于焊料测试数据来控制部件放置机构，使得仅在确定焊料的打印状态良好的单元基板上执行部件放置操作。 因此，可以防止由于电子部件的位置而导致在具有打印故障的单元基板上的浪费。

公开(公告)号：WO1995017246A1

公开(公告)日：1995-06-29

申请号：PCT/JP1994002174

申请日：1994-12-21

Applicant: TORAY INDUSTRIES, INC. ,  OGATA, Tomohiko ,  KIHARA, Masahiro ,  UEMURA, Tadahiro ,  OOTO, Katsufumi ,  FURUNO, Shyuji ,  MURATA, Yukio

Inventor： TORAY INDUSTRIES, INC.

IPC: B01J20/06

CPC classification number: B01J20/06 ,  B01D53/02 ,  B01D53/04 ,  B01D53/22 ,  B01D53/56 ,  B01D53/8625 ,  B01D53/9481 ,  B01D2253/104 ,  B01D2253/112 ,  B01D2253/308 ,  B01D2253/311 ,  B01D2257/404

Abstract: The present invention relates to a porous, selectively adsorptive material selected from an Al, Ti or Zr type oxide and having a mean pore diameter of not greater than 5 nm, and a porous, selectively adsorptive material comprising an Si oxide and having a mean pore diameter of 1 to 5 nm. The material of the present invention has particularly excellent selective adsorptivity of Nox in an alumina type material.

Abstract translation: 本发明涉及选自Al，Ti或Zr型氧化物并且平均孔径不大于5nm的多孔选择性吸附材料，以及包含Si氧化物并具有平均孔径的多孔选择性吸附材料 直径为1〜5nm。 本发明的材料在氧化铝型材料中具有特别优异的Nox选择性吸附性。