NANO-SCALE VOID REDUCTION
    1.
    发明申请
    NANO-SCALE VOID REDUCTION 审中-公开
    NANO-SCALE VOID减少

    公开(公告)号:WO2013192018A2

    公开(公告)日:2013-12-27

    申请号:PCT/US2013045747

    申请日:2013-06-13

    CPC classification number: G03F7/0002

    Abstract: Resist imprinting void reduction method may include sealing a chamber. The chamber may be filled with an ambient inert gas, wherein the inert gas a solubility in a resist layer on a substrate greater than Helium. The method may also include establishing a pressure within the chamber sufficient to cause absorption of the ambient inert gas by the resist layer, and sufficient to suppress evaporation of the resist layer.

    Abstract translation: 抗蚀刻印痕空隙缩小法可包括密封腔室。 室可以填充有环境惰性气体,其中惰性气体在基底上的抗蚀剂层中的溶解度大于氦。 该方法还可以包括在室内建立足以使抗蚀剂层吸收环境惰性气体并足以抑制抗蚀剂层蒸发的压力。

    NANO-SCALE VOID REDUCTION
    3.
    发明申请
    NANO-SCALE VOID REDUCTION 审中-公开
    纳米级减少空洞

    公开(公告)号:WO2013192018A3

    公开(公告)日:2014-05-15

    申请号:PCT/US2013045747

    申请日:2013-06-13

    CPC classification number: G03F7/0002

    Abstract: Resist imprinting void reduction method may include sealing a chamber. The chamber may be filled with an ambient inert gas, wherein the inert gas a solubility in a resist layer on a substrate greater than Helium. The method may also include establishing a pressure within the chamber sufficient to cause absorption of the ambient inert gas by the resist layer, and sufficient to suppress evaporation of the resist layer.

    Abstract translation: 抗印刻空隙减少方法可以包括密封室。 腔室可以充满环境惰性气体,其中惰性气体在基板上的抗蚀剂层中的溶解度高于氦气。 该方法还可以包括在腔室内建立足以引起抗蚀剂层对环境惰性气体的吸收并且足以抑制抗蚀剂层的蒸发的压力。

Patent Agency Ranking