公开(公告)号：WO2008031042A1

公开(公告)日：2008-03-13

申请号：PCT/US2007/077896

申请日：2007-09-07

申请人： QUALCOMM INCORPORATED ,  DEVEREUX, Jeff ,  BERGER, Fritz, Gerd ,  JOHNSTON, William, A. ,  TASSOUDJI, Mohammad Ali ,  ALDERN, Scott

发明人： DEVEREUX, Jeff ,  BERGER, Fritz, Gerd ,  JOHNSTON, William, A. ,  TASSOUDJI, Mohammad Ali ,  ALDERN, Scott

IPC分类号： H01P1/213

CPC分类号： H01P5/085 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09718 ,  H05K2201/09809 ,  Y10T29/49139

摘要： A compact Ku band microwave diplexer configured as a three port surface mount component on a miniature alumina substrate. Input signals occurring at a common port having frequencies within a first pass band are passed to a second port while being isolated from signals occurring at a third port. Signals occurring at the third port are passed to the common port while being isolated from the signals at the second port. A microstrip dual spur line filter is used combined with open circuit stubs to provide enhanced second harmonic suppression on the transmit side, while using a coupled line microstrip filter on the receive side. This approach allows for compact size and automated component assembly through pick and place and reflow manufacturing techniques.

摘要翻译： 在微型氧化铝基板上构造为三端口表面安装部件的紧凑型Ku波段微波双工器。 在具有第一通带内的频率的公共端口处发生的输入信号被传递到第二端口，同时与在第三端口处发生的信号隔离。 在第三个端口发生的信号被传递到公共端口，同时与第二个端口的信号隔​​离。 微带双支路线路滤波器与开路短路结合使用，以在接收侧使用耦合线路微带滤波器，在发射侧提供增强的二次谐波抑制。 这种方法允许通过拾取和放置和回流制​​造技术实现紧凑的尺寸和自动部件组装。

公开(公告)号：WO2008030772A3

公开(公告)日：2008-09-25

申请号：PCT/US2007077360

申请日：2007-08-31

申请人： QUALCOMM INC ,  DEVEREUX JEFF ,  BERGER FRITZ GERD ,  JOHNSTON WILLIAM A ,  TASSOUDJI MOHAMMAD ALI ,  ALDERN SCOTT

发明人： DEVEREUX JEFF ,  BERGER FRITZ GERD ,  JOHNSTON WILLIAM A ,  TASSOUDJI MOHAMMAD ALI ,  ALDERN SCOTT

IPC分类号： H01P5/08

CPC分类号： H01P5/085 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09718 ,  H05K2201/09809 ,  Y10T29/49139

摘要： A coaxial to microstrip transition is introduced in a multi layer mixed dielectric printed circuit board environment that provides a 50 Ohm impedance system between a coaxial antenna feed and a surface mount diplexer at Ku-band frequencies. The 50 Ohm transition from the coaxial antenna feed to the diplexer at microwave frequencies lossy FR-4 style laminate is provided by constructing a PCB internal coax using the center conductor of the antenna feed and a dual ring of plated through hole VIAs. The transition from the PCB internal coax to the microstrip section of the high frequency laminate PCB layer uses a "D"-style opening in the ground layer and a VIA ring arrangement between the layers to optimize or tune the performance of the transition. Additional features in the interface construction are implemented to guaranty that its microwave and mechanical performance does not degrade in extreme environmental conditions.

摘要翻译： 在多层混合介质印刷电路板环境中引入了同轴至微带转换，其在Ku波段频率下在同轴天线馈电和表面安装双工器之间提供50欧姆阻抗系统。 通过使用天线馈电的中心导体和电镀通孔VIA的双环来构建PCB内部同轴电缆，从微波频率损耗的FR-4型层压板向同轴天线馈电到双工器的50Ohm过渡提供。 从PCB内部同轴电缆到高频层压PCB层的微带部分的过渡使用地层中的“D”型开口和层之间的VIA环排列来优化或调整过渡的性能。 接口结构中的其他功能可以保证微波和机械性能在极端环境条件下不会降低。

公开(公告)号：WO2008030772A2

公开(公告)日：2008-03-13

申请号：PCT/US2007/077360

申请日：2007-08-31

申请人： QUALCOMM Incorporated ,  DEVEREUX, Jeff ,  BERGER, Fritz Gerd ,  JOHNSTON, William A. ,  TASSOUDJI, Mohammad Ali ,  ALDERN, Scott

发明人： DEVEREUX, Jeff ,  BERGER, Fritz Gerd ,  JOHNSTON, William A. ,  TASSOUDJI, Mohammad Ali ,  ALDERN, Scott

CPC分类号： H01P5/085 ,  H05K1/0243 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09718 ,  H05K2201/09809 ,  Y10T29/49139

摘要： A coaxial to microstrip transition is introduced in a multi layer mixed dielectric printed circuit board environment that provides a 50 Ohm impedance system between a coaxial antenna feed and a surface mount diplexer at Ku-band frequencies. The 50 Ohm transition from the coaxial antenna feed to the diplexer at microwave frequencies lossy FR-4 style laminate is provided by constructing a PCB internal coax using the center conductor of the antenna feed and a dual ring of plated through hole VIAs. The transition from the PCB internal coax to the microstrip section of the high frequency laminate PCB layer uses a "D"-style opening in the ground layer and a VIA ring arrangement between the layers to optimize or tune the performance of the transition. Additional features in the interface construction are implemented to guaranty that its microwave and mechanical performance does not degrade in extreme environmental conditions.

摘要翻译： 在多层混合电介质印刷电路板环境中引入了同轴微带转换，在Ku波段频率的同轴天线馈电和表面贴装双工器之间提供了50欧姆的阻抗系统。 通过使用天线馈电的中心导体和电镀通孔VIA的双环构造PCB内部同轴电缆，提供了在微波频率下从同轴天线馈电到双工器的50欧姆过渡，有损FR-4型层压板。 从PCB内部同轴电缆到高频层压PCB层的微带部分的转换使用地层中的“D”型开口和层之间的VIA环布置，以优化或调整转换的性能。 实现接口结构中的其他功能，以保证其微波和机械性能在极端环境条件下不会降解。