公开(公告)号：WO1991008850A1

公开(公告)日：1991-06-27

申请号：PCT/JP1990001591

申请日：1990-12-06

Applicant: NIPPON STEEL CORPORATION ,  MARUYAMA, Tadakatsu; ,  KITAMURA, Osamu; ,  ONO, Yasuhide; ,  KIKUCHI, Toshiharu; ,  SUZUKI, Yasuhiro ,  KURIBAYASHI, Hisao ,  UNO, Tomohiro;

Inventor： NIPPON STEEL CORPORATION

IPC: B22F01/00

CPC classification number: H01L21/4814 ,  B22F1/004 ,  B22F1/0048 ,  B22F9/04 ,  B22F2009/046 ,  B23D23/00 ,  H05K3/3478

Abstract: A method of manufacturing minute metallic balls (20) uniform in size comprising the steps of making short pieces (16; 10) of metallic wire by cutting a fine metallic wire (1) to a given length and shaping said pieces into balls by heating and melting them at a temperature higher than the melting point of said metal.

公开(公告)号：WO1998009323A1

公开(公告)日：1998-03-05

申请号：PCT/JP1997002996

申请日：1997-08-28

Applicant: NIPPON STEEL CORPORATION ,  SHIMOKAWA, Kenji ,  TATSUMI, Kohei ,  HASHINO, Eiji ,  YAMAMOTO, Toshio ,  KIKUCHI, Toshiharu

Inventor： NIPPON STEEL CORPORATION

IPC: H01L21/60

CPC classification number: H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099

Abstract: A method and device for forming bumps composed of very small metallic balls on electrodes of semiconductor chips, printed board, etc. A first invention is such that a vacuum chamber for vacuum clamping is divided into a plurality of divisions and the clamping/releasing are controlled for each division so as to prevent balls from being clamped to an array board in aggregates. Partition walls are provided in the vacuum chamber. A second invention is such that cut-off sections are provided in an edge portion of the array board so as to prevent bumps already formed from being pressed against the board again. A third invention is such that a bump forming device which hold only one ball is disclosed. A forth invention is such that bumps are formed at once on two or more diced semiconductor chips. A fifth invention is such that an optimum amount range of very small metallic balls are accurately supplied to a container. A sixth invention is such that two or more balls excessively arranged on one suction hole of the array board are reliably detected.

Abstract translation: 一种用于在半导体芯片，印刷电路板等的电极上形成由非常小的金属球构成的凸块的方法和装置。第一个发明是将真空夹紧的真空室分成多个分段，并且夹紧/释放被控制 对于每个部分，以防止球被聚集在阵列板上。 真空室内设有分隔壁。 第二发明是在阵列板的边缘部分设置切断部分，以防止已经形成的凸起再次被压在基板上。 第三发明是公开了仅保持一个球的凸块形成装置。 第四发明是在两个或多个切割的半导体芯片上一次形成凸块。 第五发明是将极小金属球的最佳量范围精确地供给到容器。 第六发明是能够可靠地检测出排列在阵列基板的一个吸孔上的两个以上的球。