公开(公告)号：WO2006101768A3

公开(公告)日：2006-09-28

申请号：PCT/US2006/008539

申请日：2006-03-09

Applicant: SKYWORKS SOLUTIONS, INC. ,  GAN, Qing ,  LOBIANCO, Anthony, J. ,  WARREN, Robert, W.

Inventor： GAN, Qing ,  LOBIANCO, Anthony, J. ,  WARREN, Robert, W.

IPC: H01L21/44

Abstract: According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.

公开(公告)号：WO2006101768A2

公开(公告)日：2006-09-28

申请号：PCT/US2006008539

申请日：2006-03-09

Applicant: SKYWORKS SOLUTIONS INC ,  GAN QING ,  LOBIANCO ANTHONY J ,  WARREN ROBERT W

Inventor： GAN QING ,  LOBIANCO ANTHONY J ,  WARREN ROBERT W

IPC: H01L21/44

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L23/10 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.

Abstract translation: 根据示例性实施例，制造晶片级封装的方法包括在器件晶片上形成聚合物层，其中器件晶片包括至少一个器件晶片接触焊盘和器件，并且其中至少一个器件晶片接触焊盘 电连接到设备。 该方法还包括将保护晶片接合到器件晶片。 该方法还包括在保护晶片中形成至少一个通孔，其中至少一个通孔延伸穿过保护晶片并且位于至少一个器件晶片接触焊盘上方。 所述方法还包括在所述保护晶片上形成至少一个保护性晶片接触焊盘，其中所述至少一个保护性晶片接触焊盘位于所述至少一个通孔上并电连接至所述至少一个器件晶片接触焊盘。