公开(公告)号：WO2013055453A3

公开(公告)日：2013-06-13

申请号：PCT/US2012052112

申请日：2012-08-23

Applicant: CONEXANT SYSTEMS INC ,  WARREN ROBERT W ,  ROSSI NIC ,  LEE HYUN JUNG

Inventor： WARREN ROBERT W ,  ROSSI NIC ,  LEE HYUN JUNG

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/31 ,  H01L23/485 ,  H01L25/065

CPC classification number: H01L24/13 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/538 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/54433 ,  H01L2224/033 ,  H01L2224/03334 ,  H01L2224/03828 ,  H01L2224/0384 ,  H01L2224/039 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/06155 ,  H01L2224/06177 ,  H01L2224/11002 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/14136 ,  H01L2224/16225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48229 ,  H01L2224/48465 ,  H01L2224/48847 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92163 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L22/14 ,  H01L2223/544 ,  H01L21/78 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a semiconductor stud bump wafer level package (110, 201, 301) and a manufacturing method thereof, comprising a semiconductor die (112, 212a, 212b, 312a, 312b) having a plurality of bond pads (130) on a top surface thereof, a plurality of metallic (e.g. copper) stud bumps (120, 220, 320) mechanically and electrically coupled to said plurality of bond pads (130), a plurality of solder balls (160, 260, 360) mechanically and electrically coupled to said plurality of metallic stud bumps (120, 220, 320) and a mould compound (140, 240, 340) encapsulating the plurality of metallic stud bumps (120, 220, 320) while exposing a top surface of each of the plurality of metallic stud bumps (120, 220, 320). In one embodiment, singulation of the wafer (101) is performed after connecting the solder balls (160) to the stud bumps (120) and subsequent testing of die proper functionality and die marking. In another embodiment, singulation of the wafer is performed before forming the mould compound (240), wherein singulated dies (212a, 212b) are mounted on a substrate (215) and subsequently encapsulated. In still another embodiment, singulated dies (312a, 312b) are mounted on a substrate (315) and bond pads (330a, 330b) at die perimeter are wire-bonded to the substrate (315), advantageously during the same manufacturing step as when the stud bumps (360) are formed, after which the moulded compound (340) is formed. Advantageously, the metallic stud bumps (120, 220, 320) may be provided using standard wirebonding equipment by directly bonding to a die bond pad (130), for example having a single aluminium finish, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure to an array of under bump metal (UBM) pads. As a result, reduced cycle times, lower cost, and reduced complexity may be provided.

Abstract translation: 提供了一种半导体凸块晶片级封装（110,201,301）及其制造方法，其包括在顶部具有多个焊盘（130）的半导体管芯（112,212a，212b，312a，312b） 机械和电耦合到所述多个接合焊盘（130）的多个金属（例如铜）螺柱凸块（120,220,320），多个焊球（160,260,360）机械和电耦合 到所述多个金属柱形突起（120,220,320）和模制化合物（140,240,340），其在暴露多个金属柱凸块（120,220,320）的顶表面的同时， 金属柱凸起（120,220,320）。 在一个实施例中，在将焊球（160）连接到螺柱凸块（120）之后进行晶片（101）的分离，并随后测试模具的正常功能和模具标记。 在另一个实施例中，在形成模具化合物（240）之前进行晶片的分割，其中分割的裸片（212a，212b）安装在基底（215）上并随后封装。 在另一个实施例中，单个模具（312a，312b）安装在基板（315）上，并且在模具周边处的接合焊盘（330a，330b）有利地在与制造步骤 形成螺柱凸起（360），之后形成模制化合物（340）。 有利地，可以使用标准引线接合设备通过直接结合到管芯接合焊盘（130）（例如具有单个铝合金）来提供金属突起凸起（120,220,320），避免了用于光刻的常规晶片级封装要求， 沉积步骤以向下凸块金属（UBM）焊盘的阵列提供多层金属布线结构。 因此，可以提供缩短的循环时间，降低成本和降低的复杂性。

公开(公告)号：WO2013039617A1

公开(公告)日：2013-03-21

申请号：PCT/US2012/050028

申请日：2012-08-08

Applicant: CONEXANT SYSTEMS, INC. ,  WARREN, Robert, W. ,  ROSSI, Nic

Inventor： WARREN, Robert, W. ,  ROSSI, Nic

IPC: H01L23/485 ,  H01L23/495 ,  H01L23/49 ,  H01L21/48

CPC classification number: H01L24/05 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05095 ,  H01L2224/29099 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48799 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/37001 ,  H01L2924/37002 ,  H01L2224/05599 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a system and method for a spot plated leadframe and an IC bond pad via array design for copper wire. There is provided a semiconductor package comprising a leadframe (130) having a pre-plated finish (133) and a spot plating (134) on said pre-plated finish (133), a semiconductor die (140) including a bond pad (144) on a top surface thereof, and a copper wire (122) bonded to said spot plating (134) and to said bond pad (144). Optionally, a novel corner via array design (246) may be provided under the bond pad (243) for improved package performance while maintaining the integrity of the copper wire bond- The semiconductor package may provide several advantages including high MSL ratings, simplified assembly cycles, avoidance of tin whisker issues, and low cost compared to conventional packages using gold wire bonds.

Abstract translation: 提供了一种用于铜线的阵列设计的点电镀引线框和IC焊盘的系统和方法。 提供一种半导体封装，其包括在所述预镀完成件（133）上具有预镀整理（133）和点镀覆（134）的引线框架（130），包括接合焊盘（144）的半导体管芯 ）和与所述点电镀（134）和所述接合焊盘（144）接合的铜线（122）。 可选地，可以在接合焊盘（243）下方提供新颖的角通孔阵列设计（246），以改善封装性能，同时保持铜线接合的完整性。半导体封装可提供若干优点，包括高MSL等级，简化组装循环 避免锡晶须问题，与使用金线键的传统封装相比成本较低。

公开(公告)号：WO2008005733A3

公开(公告)日：2008-05-02

申请号：PCT/US2007072003

申请日：2007-06-25

Applicant: AGERE SYSTEMS INC ,  BAHRAM NIKOLAI K ,  AL-REFAEE FADI AFA ,  WARREN ROBERT W ,  HADDAD STEPHEN N

Inventor： BAHRAM NIKOLAI K ,  AL-REFAEE FADI AFA ,  WARREN ROBERT W ,  HADDAD STEPHEN N

IPC: G06F15/16

CPC classification number: H04M1/6091 ,  H04L67/04 ,  H04L67/12 ,  Y02D30/40 ,  Y02D70/00 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/168

Abstract: Various systems and methods for allowing multi-user access to a wireless storage device are disclosed. For example, some embodiments of the present invention provide methods for sharing content objects that include providing a wireless storage device that is operable to communicably couple to a master device and a sharing device. The wireless storage device includes a memory on which one or more content objects are stored. The methods further include receiving a request to share that identifies the sharing device; and authorizing the request to share. Through authorizing the request to share, the sharing device is authorized to receive the content object.

Abstract translation: 公开了允许多用户访问无线存储设备的各种系统和方法。 例如，本发明的一些实施例提供了共享内容对象的方法，所述内容对象包括提供可操作以可通信地耦合到主设备和共享设备的无线存储设备。 无线存储装置包括存储有一个或多个内容对象的存储器。 所述方法还包括接收识别共享设备的共享请求; 并授权请求分享。 通过授权共享请求，共享设备被授权接收内容对象。

公开(公告)号：WO2009067299A1

公开(公告)日：2009-05-28

申请号：PCT/US2008/079336

申请日：2008-10-09

Applicant: SKYWORKS SOLUTIONS, INC. ,  KIM, Patrick ,  KUHLMAN, Mark, A. ,  GUO, Yifan ,  LOBIANCO, Anthony ,  WARREN, Robert, W.

Inventor： KIM, Patrick ,  KUHLMAN, Mark, A. ,  GUO, Yifan ,  LOBIANCO, Anthony ,  WARREN, Robert, W.

IPC: H01L21/60

CPC classification number: H01L23/49811 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A substrate pad in a semiconductor package having a geometry and structure that facilitates providing a solder joint to the pad that has enhanced structural integrity and resistance to mechanical impact. The pad may include a plated metal stud that anchors the solder to the pad interface, providing a more compliant solder joint, even when lead- free solder is used.

Abstract translation: 具有几何形状和结构的半导体封装中的衬底焊盘，其有助于提供具有增强的结构完整性和抗机械冲击的焊盘的焊接接头。 焊盘可以包括电镀金属螺柱，其将焊料锚定到焊盘接口，提供更柔顺的焊接接头，即使当使用无铅焊料时。

公开(公告)号：WO2007108964A3

公开(公告)日：2008-06-12

申请号：PCT/US2007006079

申请日：2007-03-09

Applicant: SKYWORKS SOLUTIONS INC ,  SHEN HONG ,  RAMANATHAN RAVI ,  LUO QIULIANG ,  WARREN ROBERT W ,  ABDALI USAMA K

Inventor： SHEN HONG ,  RAMANATHAN RAVI ,  LUO QIULIANG ,  WARREN ROBERT W ,  ABDALI USAMA K

IPC: H01L21/283 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/492

CPC classification number: H01L23/4924 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10157 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/01031

Abstract: A gallium arsenide device (11) has a GaAs substrate (14) and a copper contact layer (21) for making electrical ground contact with a pad (16) of a target device. The copper contact layer is isolated from the GaAs substrate via a diffusion barrier layer (23), such as a nickel vanadium (NiV) layer. An organic solder preservative may coat the exposed copper to reduce oxidation effects. A gold or copper seed layer may be deposited prior to depositing the copper contact layer. The copper contact layer (21) can be directly soldered (18) to the contact pad (16), implying that the contact pad does not require an adhesive overflow area and can be made relatively small.

Abstract translation: 砷化镓器件（11）具有用于与目标器件的焊盘（16）电接地接触的GaAs衬底（14）和铜接触层（21）。 铜接触层通过诸如镍钒（NiV）层的扩散阻挡层（23）与GaAs衬底隔离。 有机锡防腐剂可以涂覆暴露的铜以减少氧化效应。 在沉积铜接触层之前可以沉积金或铜种子层。 铜接触层（21）可以直接焊接（18）到接触焊盘（16），这意味着接触焊盘不需要粘合剂溢出区域并且可以制造得相对较小。

公开(公告)号：WO2008005732A2

公开(公告)日：2008-01-10

申请号：PCT/US2007/072000

申请日：2007-06-25

Applicant: AGERE SYSTEMS INC. ,  AL-REFAEE, Fadi, Afa ,  BAHRAM, Nikolai, K. ,  HADDAD, Stephen, N. ,  WARREN, Robert, W.

Inventor： AL-REFAEE, Fadi, Afa ,  BAHRAM, Nikolai, K. ,  HADDAD, Stephen, N. ,  WARREN, Robert, W.

IPC: G06F21/24

CPC classification number: H04M1/6091 ,  H04L67/04 ,  H04L67/12 ,  Y02D30/40 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/168

Abstract: Various systems and methods for distributing rights managed content objects are disclosed. For example, some embodiments of the present invention provide methods for distribution that include providing a mobile storage device that includes a wireless interface and a storage component maintaining a rights managed content object. A first request to provide the rights managed content object to a first mobile application device via the wireless interface is received, and a second request to provide the rights managed content object to a second mobile application device via the wireless interface is received. The rights managed content object is accessed from the storage component, and a digital rights management tool associated with the accessed content object is accessed. The rights managed content object is decrypted using the digital rights management tool, and streamed to both the first mobile application device and the second mobile application device via the wireless interface.

Abstract translation: 公开了用于分发权限管理的内容对象的各种系统和方法。 例如，本发明的一些实施例提供了分发方法，其包括提供包括无线接口的移动存储设备和维护权限管理的内容对象的存储组件。 接收经由无线接口向第一移动应用设备提供权限管理的内容对象的第一请求，并且接收经由无线接口向第二移动应用设备提供权限管理的内容对象的第二请求。 从存储组件访问权限管理的内容对象，并且访问与所访问的内容对象相关联的数字版权管理工具。 权利管理的内容对象使用数字版权管理工具解密，并通过无线接口流式传输到第一移动应用设备和第二移动应用设备。

公开(公告)号：WO2008005730A2

公开(公告)日：2008-01-10

申请号：PCT/US2007/071989

申请日：2007-06-25

Applicant: AGERE SYSTEMS INC. ,  WARREN, Robert, W. ,  HADDAD, Stephen, N. ,  AL-REFAEE, Fadi, Afa ,  BAHRAM, Nikolai, K.

Inventor： WARREN, Robert, W. ,  HADDAD, Stephen, N. ,  AL-REFAEE, Fadi, Afa ,  BAHRAM, Nikolai, K.

IPC: H04J1/02

CPC classification number: H04M1/6091 ,  H04L67/04 ,  H04L67/12 ,  Y02D30/40 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/168

Abstract: Various systems and methods for implementing operational environments are disclosed. For example, some embodiments of the present invention provide hands free operational environments that include a routing device, an audio transmission device, an audio output device, and an audio input device. The routing device communicably couples the audio transmission device to one or more of the audio input device and the audio output device. The audio input device is operable to receive an audible command. The audible command is operable to cause an operation on at least one of the routing device, the audio output device, and the audio transmission device.

Abstract translation: 公开了用于实现操作环境的各种系统和方法。 例如，本发明的一些实施例提供了免提操作环境，其包括路由设备，音频传输设备，音频输出设备和音频输入设备。 路由设备将音频传输设备可通信地耦合到音频输入设备和音频输出设备中的一个或多个。 音频输入设备可操作来接收可听指令。 可听命令可操作用于在路由设备，音频输出设备和音频传输设备中的至少一个上进行操作。

公开(公告)号：WO2007041100A2

公开(公告)日：2007-04-12

申请号：PCT/US2006/037480

申请日：2006-09-26

Applicant: SKYWORKS SOLUTIONS, INC. ,  WARREN, Robert, W. ,  LIANG, Steve, X. ,  LOBIANCO, Tony ,  GAN, Gene

Inventor： WARREN, Robert, W. ,  LIANG, Steve, X. ,  LOBIANCO, Tony ,  GAN, Gene

IPC: H05K7/00

CPC classification number: H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/30107 ,  H05K1/144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic module and a process for forming an electronic module are provided. Uniform and sealed air gaps are formed in a vertical direction between two or more electronic devices. The uniform and sealed air gaps are formed by arranging spacers between the electronic devices, where the height of the spacers is selected depending upon the operating characteristics of the particular type of electronic devices.

Abstract translation: 提供了一种电子模块和用于形成电子模块的过程。 在两个或更多电子设备之间沿垂直方向形成均匀且密封的气隙。 通过在电子装置之间布置间隔物来形成均匀且密封的气隙，其中间隔物的高度根据特定类型的电子装置的操作特性来选择。

公开(公告)号：WO2006101768A3

公开(公告)日：2006-09-28

申请号：PCT/US2006/008539

申请日：2006-03-09

Applicant: SKYWORKS SOLUTIONS, INC. ,  GAN, Qing ,  LOBIANCO, Anthony, J. ,  WARREN, Robert, W.

Inventor： GAN, Qing ,  LOBIANCO, Anthony, J. ,  WARREN, Robert, W.

IPC: H01L21/44

Abstract: According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.

公开(公告)号：WO2006101768A2

公开(公告)日：2006-09-28

申请号：PCT/US2006008539

申请日：2006-03-09

Applicant: SKYWORKS SOLUTIONS INC ,  GAN QING ,  LOBIANCO ANTHONY J ,  WARREN ROBERT W

Inventor： GAN QING ,  LOBIANCO ANTHONY J ,  WARREN ROBERT W

IPC: H01L21/44

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L23/10 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: According to an exemplary embodiment, a method for fabricating a wafer level package includes forming a polymer layer on a device wafer, where the device wafer includes at least one device wafer contact pad and a device, and where the at least one device wafer contact pad is electrically connected to the device. The method further includes bonding a protective wafer to the device wafer. The method further includes forming at least one via in the protective wafer, where the at least one via extends through the protective wafer and is situated over the at least one device wafer contact pad. The method further includes forming at least one protective wafer contact pad on the protective wafer, where the at least one protective wafer contact pad is situated over the at least one via and electrically connected to the at least one device wafer contact pad.

Abstract translation: 根据示例性实施例，制造晶片级封装的方法包括在器件晶片上形成聚合物层，其中器件晶片包括至少一个器件晶片接触焊盘和器件，并且其中至少一个器件晶片接触焊盘 电连接到设备。 该方法还包括将保护晶片接合到器件晶片。 该方法还包括在保护晶片中形成至少一个通孔，其中至少一个通孔延伸穿过保护晶片并且位于至少一个器件晶片接触焊盘上方。 所述方法还包括在所述保护晶片上形成至少一个保护性晶片接触焊盘，其中所述至少一个保护性晶片接触焊盘位于所述至少一个通孔上并电连接至所述至少一个器件晶片接触焊盘。