公开(公告)号：WO1984001258A1

公开(公告)日：1984-03-29

申请号：PCT/JP1982000382

申请日：1982-09-22

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  MURAKAMI, Shuichi ,  MATSUDA, Chuichi ,  MATSUMAE, Tatsuya ,  YAMASHITA, Kenichi ,  MORI, Mikio

Inventor： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

IPC: H05K03/34

CPC classification number: H05K3/3468 ,  B23K3/0684 ,  H05K2203/0292 ,  H05K2203/1581

Abstract: Device for soldering a printed board, which has a nozzle (14a) provided in a solder tank (14) containing molten solder so as to form a molten solder fountain (15), printed board conveyor (25) passing a printed board (17) through the solder fountain (15) to solder a chip (26) onto the printed board (17), and a vibration applying unit (22) for applying vibrations to the printed board (17) as the board passes through the solder wave (15).