Abstract:
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5-2 to 0.1-5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.
Abstract:
The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5-2 to 0.1-5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.
Abstract:
The present invention is an information system that includes: a first computer; a first storage apparatus; a first network apparatus, to which the first computer and the first storage apparatus are connected, providing a first fabric service; a second computer; a second storage apparatus; a second network apparatus, to which the second computer and the second storage apparatus are connected, providing a second fabric service; and a network that connectes the first network apparatus and the second network apparatus, wherein the first computer accesses the first fabric service, the second computer accesses the second fabric service, and the first storage apparatus and the second storage apparatus access the first fabric service and the second fabric service, respectively.
Abstract:
This invention is roughly divided into two, i.e., a film in which a pattern is formed by providing one main surface of a flexible insulating film (1) with a first metallic film (2) which consists of one kind of metal chosen among copper, silver, nickel and aluminum, or an alloy thereof, a second metallic film (3) consisting of one kind of metal chosen among nickel, chromium, tungsten and silver, or an alloy thereof, a third isotropic conductive film (4) consisting of carbon powder and synthetic resin, and a fourth anisotropic conductive film (7a) consisting of carbon powder and synthetic resin; and an anisotropic conductive bonding agent. Owing to the functions of these products, a film connector capable of reliably carrying out the electrical connection of even the high-density terminal leads, and having an improved reliability can be obtained.
Abstract:
Since no access history is generated for when a file update which makes use of a copy and paste function is performed, it is difficult to detect the file that served as the reference source during the update. Hence, the present invention is provided to manage a client access history for each file that is stored in a storage device, and detect a file, which has been accessed between a time when a corresponding user logs into the storage device and a time when an updated file is updated based on information of the access history, as the reference source for the updated file.
Abstract:
A conductive circuit pattern portion is formed on an insulating substrate film, the pattern portion being constituted by a laminate of a thin metal film pattern layer with excellent electrical properties and an easily formable printed pattern layer, and a hot-melt adhesive layer with anisotropic electrical conductivity is further formed on the circuit pattern portion, whereby it is possible to easily a flexible conductive film connector which is accurately formed with a minute conductive circuit pattern having excellent electrical characteristics. The conductive film connector has excellent electrical characteristics and makes it possible to obtain complete adhesion. Further, there is no danger that the conductive film connector will fail as a result of long use; hence, it provides a highly reliable connection.