公开(公告)号：WO2004005528A3

公开(公告)日：2004-01-15

申请号：PCT/JP2003/006262

申请日：2003-05-20

Applicant: NIHON NEW CHROME CO., LTD. ,  URATA, Kazuya ,  TACHIBANA, Kunio ,  ONIWA, Naoyuki ,  TAJIMA, Mikiya ,  OGAWA, Yukio

Inventor： URATA, Kazuya ,  TACHIBANA, Kunio ,  ONIWA, Naoyuki ,  TAJIMA, Mikiya ,  OGAWA, Yukio

IPC: C25D3/58

Abstract: The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5-2 to 0.1-5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.

公开(公告)号：WO2004005528A2

公开(公告)日：2004-01-15

申请号：PCT/JP0306262

申请日：2003-05-20

Applicant: NIHON NEW CHROME CO LTD ,  URATA KAZUYA ,  TACHIBANA KUNIO ,  ONIWA NAOYUKI ,  TAJIMA MIKIYA ,  OGAWA YUKIO

Inventor： URATA KAZUYA ,  TACHIBANA KUNIO ,  ONIWA NAOYUKI ,  TAJIMA MIKIYA ,  OGAWA YUKIO

IPC: C25D3/56 ,  C25D3/58 ,  C12Q

CPC classification number: C25D3/58 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: The invention relates to a pyrophosphoric acid bath for use in cyanogen-free copper-tin alloy plating that contains an additive (A) composed an amine derivative, an epihalohydrin and a glycidyl ether compound with ratios of epihalohydrin to glycidyl ether compound being 0.5-2 to 0.1-5 on mol basis, per 1 mol of the amine derivative, has a pH of 3 to 9, and optionally contains an additive (B) composed of an organic sulfonic acid and/or an organic sulfonic acid salt, and to a copper-tin alloy coating obtainable by using the bath. The invention provides a pyrophosphoric acid bath for use in copper-tin alloy plating of the cyanogen-free type utilizable on an industrial scale, particularly, capable of performing uniform treatment to exhibit low defective product generation rates even with the current density being incessantly changing between a high state and a low state, as a barrel plating method, and a copper-tin alloy coating obtainable by using the bath.

Abstract translation: 本发明涉及一种用于无氰铜铜合金电镀的焦磷酸浴，其含有由表面卤代醇与缩水甘油醚化合物的比例为0.5-2的胺衍生物，表卤代醇和缩水甘油醚化合物组成的添加剂（A） 相对于1摩尔的胺衍生物为0.1〜5摩尔，pH为3〜9，并且任选地含有由有机磺酸和/或有机磺酸盐构成的添加剂（B），和 铜 - 锡合金涂层可通过使用该浴来获得。 本发明提供了一种用于工业规模可利用的无氰类型的铜 - 锡合金电镀的焦磷酸浴，特别是能够进行均匀处理以表现出低的缺陷产物产生速率，即使电流密度不断变化， 高状态和低状态，作为滚镀方法，以及通过使用该浴可获得的铜 - 锡合金涂层。