公开(公告)号：WO2007019277A3

公开(公告)日：2007-07-12

申请号：PCT/US2006030374

申请日：2006-08-02

Applicant: CALIFORNIA INST OF TECHN ,  MORRAL ANNA FONTCUBERTA I ,  ZAHLER JAMES M ,  LADOUS CORINNE ,  ATWATER HARRY A ,  OLSON SEAN M

Inventor： MORRAL ANNA FONTCUBERTA I ,  ZAHLER JAMES M ,  LADOUS CORINNE ,  ATWATER HARRY A ,  OLSON SEAN M

IPC: H01L21/30

CPC classification number: H01L21/76254 ,  H01L21/26506

Abstract: A method of making a semiconductor thin film bonded to a handle substrate includes implanting a semiconductor substrate with a light ion species while cooling the semiconductor substrate, bonding the implanted semiconductor substrate to the handle substrate to form a bonded structure, and annealing the bonded structure, such that the semiconductor thin film is transferred from the semiconductor substrate to the handle substrate.

Abstract translation: 一种制造结合到处理基板的半导体薄膜的方法包括：在冷却半导体基板的同时注入具有轻离子种类的半导体基板;将注入的半导体基板结合到处理基板以形成结合结构;以及对结合结构进行退火， 使得半导体薄膜从半导体衬底转移到处理衬底。

公开(公告)号：WO2007019277A2

公开(公告)日：2007-02-15

申请号：PCT/US2006/030374

申请日：2006-08-02

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY ,  MORRAL, Anna, Fontcuberta i ,  ZAHLER, James, M. ,  LADOUS, Corinne ,  ATWATER, Harry, A. ,  OLSON, Sean, M.

Inventor： MORRAL, Anna, Fontcuberta i ,  ZAHLER, James, M. ,  LADOUS, Corinne ,  ATWATER, Harry, A. ,  OLSON, Sean, M.

IPC: H01L21/30

CPC classification number: H01L21/76254 ,  H01L21/26506

Abstract: A method of making a semiconductor thin film bonded to a handle substrate includes implanting a semiconductor substrate with a light ion species while cooling the semiconductor substrate, bonding the implanted semiconductor substrate to the handle substrate to form a bonded structure, and annealing the bonded structure, such that the semiconductor thin film is transferred from the semiconductor substrate to the handle substrate.

Abstract translation: 制造结合到手柄基板上的半导体薄膜的方法包括：在半导体衬底冷却时注入具有轻离子物质的半导体衬底，将注入的半导体衬底接合到手柄衬底上以形成结合结构，并对结合结构进行退火， 使得半导体薄膜从半导体衬底转移到手柄衬底。