公开(公告)号：WO2011072990A2

公开(公告)日：2011-06-23

申请号：PCT/EP2010/067964

申请日：2010-11-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  SU, James ,  QUACKENBUSH, Richard, Alan ,  WILSON, John, Thomas

Inventor： SU, James ,  QUACKENBUSH, Richard, Alan ,  WILSON, John, Thomas

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H05K3/28 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2201/09545 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2203/0228 ,  H05K2203/0242 ,  Y10T29/49156

Abstract: The present invention provides a printed circuit board assembly that includes a first printed circuit board portion having a first thickness and including at least one plated through hole selectively electrically interconnecting electrically conductive layers of the printed circuit board assembly. A second printed circuit board portion is also provided that has a second thickness which is less than the first thickness and further includes another a second plated through hole array exposed on a surface of the second printed circuit board portion.

Abstract translation: 本发明提供了一种印刷电路板组件，其包括具有第一厚度的第一印刷电路板部分，并且包括至少一个电镀通孔，其选择性地电连接印刷电路板组件的导电层。 还提供了第二印刷电路板部分，其具有小于第一厚度的第二厚度，并且还包括暴露在第二印刷电路板部分的表面上的另一个第二电镀通孔阵列。

公开(公告)号：WO2011072990A3

公开(公告)日：2011-09-15

申请号：PCT/EP2010067964

申请日：2010-11-23

Applicant: IBM ,  IBM UK ,  SU JAMES ,  QUACKENBUSH RICHARD ALAN ,  WILSON JOHN THOMAS

Inventor： SU JAMES ,  QUACKENBUSH RICHARD ALAN ,  WILSON JOHN THOMAS

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H05K3/28 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2201/09545 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2203/0228 ,  H05K2203/0242 ,  Y10T29/49156

Abstract: The present invention provides a printed circuit board assembly that includes a first printed circuit board portion having a first thickness and including at least one plated through hole selectively electrically interconnecting electrically conductive layers of the printed circuit board assembly. A second printed circuit board portion is also provided that has a second thickness which is less than the first thickness and further includes another a second plated through hole array exposed on a surface of the second printed circuit board portion.

Abstract translation: 本发明提供了一种印刷电路板组件，其包括具有第一厚度并包括选择性电互连印刷电路板组件的导电层的至少一个电镀通孔的第一印刷电路板部分。 还提供了第二印刷电路板部分，其具有小于第一厚度的第二厚度并且还包括暴露在第二印刷电路板部分的表面上的另一个第二电镀通孔阵列。