公开(公告)号：WO2006073947A3

公开(公告)日：2007-04-05

申请号：PCT/US2005047109

申请日：2005-12-13

Applicant: LAM RES CORP ,  RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

Inventor： RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

IPC: H01L21/00

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

Abstract: An apparatus for control of a temperature of a substrate has a temperature­controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract translation: 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，介电材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合材料将金属板和加热器粘合到温度受控基底的顶面。 该粘合剂层是机械柔性的，并且具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备表面的物理性质。 电介质材料层形成静电夹持机构并支撑衬底。

公开(公告)号：WO2006073947A2

公开(公告)日：2006-07-13

申请号：PCT/US2005/047109

申请日：2005-12-13

Applicant: LAM RESEARCH CORPORATION ,  RICCI, Anthony, J. ,  COMENDANT, Keith ,  TAPPAN, James

Inventor： RICCI, Anthony, J. ,  COMENDANT, Keith ,  TAPPAN, James

IPC: H01L21/00

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

Abstract: An apparatus for control of a temperature of a substrate has a temperature­controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract translation: 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，介电材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。