Abstract:
The invention relates to a method for producing a solar cell (70), wherein a layer stack (74, 76) of dielectric layers (74, 76) is applied (14, 16; 54, 56) to a back of a solar cell substrate (72) and the layer stack (74, 75) is heated and is held (20) at temperatures of at least 700°C during a time period of at least 5 minutes. The invention further relates to a solar cell (70).
Abstract:
The invention relates to a method for producing a silicon solar cell which is smoothly etched on one side, in which a front and rear side of a silicon substrate are etched (10) to form a smooth texture, a dielectric coating is then applied onto the rear side of the silicon substrate (14, 16), and the front side of the silicon substrate is subsequently textured (20) by means of a texture etching medium. According to the invention, the dielectric coating formed on the rear side of the silicon substrate is used as an etching mask against the texture etching medium.
Abstract:
The invention relates to a solar cell (11; 21; 31) comprising a dielectric coating (4) which is disposed on a rear face of the solar cell (11; 21; 31) and is covered at least partially by at least one flat contact (12; 22; 32), wherein a boundary line (14; 24; 34) of the at least one flat contact (12; 22; 32) has at least one recess (16a, 16b; 26a, 26b, 26c). The invention also relates to a method for producing same.
Abstract:
The invention relates to a method for doping a semiconductor substrate (50), wherein the semiconductor substrate (50) is heated by irradiation (14) with laser radiation (60) and at the same time dopant from a dopant source (54) is diffused (16) into the semiconductor substrate (50) in heated regions (52), and wherein when the semiconductor substrate (50) is heated by the irradiation (14) with laser radiation (60), a surface portion of the semiconductor substrate (50) that is less than 10% of the total surface of all irradiated regions (62) is melted (18) and recrystallized (20). The invention further relates to a solar cell.