公开(公告)号：WO1998045505A1

公开(公告)日：1998-10-15

申请号：PCT/JP1997001187

申请日：1997-04-07

Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD. ,  SHIROTA, Hideki ,  OKADA, Jun

Inventor： OKUNO CHEMICAL INDUSTRIES CO., LTD.

IPC: C25D05/56

CPC classification number: C25D5/56 ,  C23C18/1601 ,  C23C18/1653 ,  C23C18/285 ,  C23C18/30

Abstract: A method of electroplating a nonconductive plastic molded product is provided, which comprises the steps of applying an electroless plating catalyst to a nonconductive plastic molded product by using a colloidal solution containing a noble metal compound and a stannous compound, forming on the resultant product a conductive film by using an electroless plating liquid containing a copper compound, reducible saccharides, a complexing agent and a metal hydroxide, and then electroplating the resultant product. By this simple method, an electroplating film having excellent appearance and physical properties is formed on a nonconductive plastic molded product.

Abstract translation: 提供了一种电镀非导电塑料模制产品的方法，其包括以下步骤：通过使用含有贵金属化合物和亚锡化合物的胶体溶液将非化学镀催化剂施加到非导电塑料模制产品上，在所得产品上形成导电 通过使用含有铜化合物，可还原糖，络合剂和金属氢氧化物的化学镀液，然后电镀所得产物。 通过这种简单的方法，在非导电塑料模塑产品上形成具有优异外观和物理性质的电镀膜。