公开(公告)号：WO2004038053A2

公开(公告)日：2004-05-06

申请号：PCT/JP2003/013511

申请日：2003-10-23

Applicant: KOA KABUSHIKI KAISHA ,  SOLDERCOAT CO., LTD. ,  OKABE GIKEN CO., LTD. ,  KOBAYASHI, Satoru ,  KATO, Kazuyuki ,  SUGIURA, Masahiro ,  OKABE, Saburo

Inventor： KOBAYASHI, Satoru ,  KATO, Kazuyuki ,  SUGIURA, Masahiro ,  OKABE, Saburo

IPC: C22C18/00

CPC classification number: C22C13/00 ,  B23K35/262 ,  B23K35/282 ,  C22C18/00 ,  C23C2/06 ,  Y10T428/12708 ,  Y10T428/12792

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract translation: 不含铅（无铅焊料）的焊料含有锌和锡，并且还含有5重量％以下的镍和0.5重量％以下的铝，液相温度为260℃以上。 此外，无铅焊料的液相温度为260℃以上，含有30〜70重量％的锌，5重量％以下的镍，剩余重量百分比的锡。 此外，使用这些无铅焊料制造接头。 结果，可以提供具有优异的电特性但不包括有害物质的无铅焊料和无铅接头。

公开(公告)号：WO2004038053A3

公开(公告)日：2004-08-19

申请号：PCT/JP0313511

申请日：2003-10-23

Applicant: KOA KABUSHIKI KAISHA ,  SOLDERCOAT CO LTD ,  OKABE GIKEN CO LTD ,  KOBAYASHI SATORU ,  KATO KAZUYUKI ,  SUGIURA MASAHIRO ,  OKABE SABURO

Inventor： KOBAYASHI SATORU ,  KATO KAZUYUKI ,  SUGIURA MASAHIRO ,  OKABE SABURO

IPC: B23K35/26 ,  B23K35/28 ,  C22C13/00 ,  C22C18/00 ,  C23C2/06 ,  H05K3/34

CPC classification number: C22C13/00 ,  B23K35/262 ,  B23K35/282 ,  C22C18/00 ,  C23C2/06 ,  Y10T428/12708 ,  Y10T428/12792

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract translation: 不含铅的焊料（无铅焊料）含有锌和锡，并且还含有5重量％或更少的镍和0.5重量％或更少的铝，液相温度为260℃或更高。 此外，无铅焊料具有260℃或更高的液相温度，并且含有30至70重量百分比的锌，5重量百分比或更少的镍以及剩余的锡重量百分比。 而且，使用这些无铅焊料制造接头。 结果，可以提供具有优良电特性但不含有害物质的无铅焊料和无铅接头。