APPARATUS AND METHOD
    1.
    发明申请
    APPARATUS AND METHOD 审中-公开
    装置和方法

    公开(公告)号:WO2009056865A2

    公开(公告)日:2009-05-07

    申请号:PCT/GB2008/003719

    申请日:2008-11-03

    Abstract: An apparatus for cutting floor tiles (6) of readily cuttable material comprises a guiding device (10) for guiding movement of the apparatus along a vertical wall (4) adjacent to a floor (2) being covered, a cutting device for forming a downward cut (34) across a tile (6) on the floor (2), and a tie device (18) extending from the guiding device (10) and along which the cutting device (22) is adjustable towards and away from the guiding device (10).

    Abstract translation: 一种用于切割易切削材料的地砖(6)的装置,包括用于引导装置沿着邻近被覆盖的地板(2)的垂直壁(4)引导装置的引导装置(10),用于形成向下 切割(34)穿过地板(2)上的瓦片(6),以及从引导装置(10)延伸的连接装置(18),并且切割装置(22)可以朝向和远离引导装置 (10)。

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