公开(公告)号：WO2022212200A1

公开(公告)日：2022-10-06

申请号：PCT/US2022/021933

申请日：2022-03-25

Applicant: TERECIRCUITS CORPORATION

Inventor： SHEATS, Jayna

IPC: G03F7/09 ,  G03F7/095 ,  G03F1/38 ,  G03F7/0755 ,  G03F7/105 ,  G03F7/2014 ,  G03F7/203 ,  G03F7/34

Abstract: Intermittently photobleached mask with photobleachable and photobleached regions are described, as well as their fabrication and use to selectively release components from a substrate. Intermittently photobleached mask may allow a plurality of select components to be released simultaneously from a donor plate comprising a release layer, thereby facilitating component transfer.

公开(公告)号：WO2022212478A1

公开(公告)日：2022-10-06

申请号：PCT/US2022/022514

申请日：2022-03-30

Applicant: TERECIRCUITS CORPORATION

Inventor： SHEATS, Jayna

IPC: H01L33/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L27/15 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L24/97 ,  H01L25/0753 ,  H01L2933/0008 ,  H01L33/0093 ,  H01L33/0095

Abstract: Selective donor plates comprising at least one raised "mesa" and a release layer disposed over the top mesa surface are described, as well as their methods of use and their methods of fabrication. The use of selective donor plates including mesas and a release layer may enable reduced standoff distances and misplacement of components, as well as improve assembly time of devices.

公开(公告)号：WO2022212492A2

公开(公告)日：2022-10-06

申请号：PCT/US2022/022532

申请日：2022-03-30

Applicant: TERECIRCUITS CORPORATION

Inventor： SHEATS, Jayna

IPC: H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065 ,  H01L21/022 ,  H01L21/566 ,  H01L21/568 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L23/3135 ,  H01L23/3192 ,  H01L24/96 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/3512

Abstract: Assembly and laminates used for or in integrated circuit manufacturing are described, as well as the methods of fabrication and use. The assemblies may include closely spaced components held in place by a release layer or by vacuum applied to a porous substrate, and at least one embedding material deposited to encapsulate the components while leaving the side of the components comprising pads uncoated, thereby forming a laminate of the components and embedding material.

公开(公告)号：WO2023086403A1

公开(公告)日：2023-05-19

申请号：PCT/US2022/049432

申请日：2022-11-09

Applicant: TERECIRCUITS CORPORATION

Inventor： SHEATS, Jayna ,  ROBINSON, Matthew

IPC: H01L21/67

Abstract: A process for transferring a component from a release layer by exposing the release layer to light and heat from different sources is described. The process includes providing an assembly comprising a substrate, a release layer and a component, heating the release layer and exposing the release layer to an actinic wavelength of light, wherein the heating source and the actinic irradiation source are different sources.

公开(公告)号：WO2023023554A1

公开(公告)日：2023-02-23

申请号：PCT/US2022/075086

申请日：2022-08-17

Applicant: TERECIRCUITS CORPORATION

Inventor： LOVE, Dillon M.

IPC: C08G65/34 ,  C08G64/02 ,  C08G64/30 ,  C08G64/38

Abstract: Release layers that include an oligomeric component comprising a unit of the Formula (I) are useful for releasably transferring components from one surface to another during manufacturing of microelectronic devices.