公开(公告)号：WO2018184595A1

公开(公告)日：2018-10-11

申请号：PCT/CN2018/082186

申请日：2018-04-08

Applicant: TIANJIN LAIRD TECHNOLOGIES LIMITED

Inventor： ZHAO, Daniel ,  SHEN, Jingbo ,  LIN, Xuefeng ,  ZHOU, Jie

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H05K1/0225 ,  H05K7/20454 ,  H05K9/0026 ,  H05K2201/066 ,  H05K2201/0715

Abstract: In an exemplary embodiment, a heat dissipation device is configured to dissipate heat from electronic components on a printed circuit board. The heat dissipation device generally includes a support mechanism comprising a main body and a connecting portion along an edge of the main body. The main body and the connecting portion form an internal space for accommodating the electronic components. The main body includes opposite first and second surfaces. The first surface faces the electronic component when the support mechanism is connected to the printed circuit board through the connecting portion. A first heat transfer member is disposed on the first surface. When the support mechanism is connected with the printed circuit board through the connecting portion, the first heat transfer member may be in contact with the one or more components and have a thickness of about 2 mils to about 15 mils.

公开(公告)号：WO2021142766A1

公开(公告)日：2021-07-22

申请号：PCT/CN2020/072710

申请日：2020-01-17

Applicant: TIANJIN LAIRD TECHNOLOGIES LIMITED

Inventor： ZHOU, Jie ,  REN, Yuan

IPC: H01L21/67 ,  B23P19/10

Abstract: Disclosed are systems for applying materials (e.g., thermal interface material, other material, etc.) from a supply (e.g., roll, reel, tape, etc.) of the material to a component, substrate, part, plate, another material, or other target surface. In exemplary embodiments, the system includes a tool (e.g., a roller, rolling device, etc.) configured to be movable relative to a supply of a material for positioning a portion of the material from the supply along a component (or other target surface), and thereby forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material when the tool is moved relatively along the portion of the material.

公开(公告)号：WO2021079194A2

公开(公告)日：2021-04-29

申请号：PCT/IB2020/000916

申请日：2020-10-23

Applicant: TIANJIN LAIRD TECHNOLOGIES LIMITED

Inventor： ZHAO, Jingqi ,  LIN, Xuefeng

IPC: B29B7/74 ,  B29B7/82 ,  B29B7/90 ,  B29B7/007 ,  B29B7/726 ,  B29B7/748 ,  B29B7/826 ,  B29C64/00

Abstract: A system and method for dispensing thermal management and/or EMI mitigation materials is provided. The system and method includes online remixing prior to dispensing the thermal management and/or EMI mitigation materials. The system includes an online remixer(104) configured to be operable for receiving a supply of the thermal management and/or EMI mitigation material including one or more functional fillers within the matrix, remixing the one or more functional fillers including filler settlement, if any, within the matrix prior to dispensement of the thermal management and/or EMI mitigation. The remixing may reduce the filler settlement, if any, within the matrix and thereby allow for improved viscosity and flow rate of the thermal management and/or EMI mitigation material.