OPTICAL TIME DOMAIN REFLECTOMETER WITH HIGH RESOLUTION AND HIGH SENSITIVITY
    3.
    发明申请
    OPTICAL TIME DOMAIN REFLECTOMETER WITH HIGH RESOLUTION AND HIGH SENSITIVITY 审中-公开
    具有高分辨率和高灵敏度的光学时域反射仪

    公开(公告)号:WO2013155235A1

    公开(公告)日:2013-10-17

    申请号:PCT/US2013/036047

    申请日:2013-04-10

    CPC classification number: G01M11/3109 G01M11/3145

    Abstract: An optical time domain reflectometer (OTDR) system with an integrated high speed optical modulator is capable of operating at a speed similar to the OTDR pulse width to improve the measurement resolution and reduce the time required to acquire a high dynamic range OTDR measurement over existing approaches. ASICs can be used to control the modulator and generation of pulses. The high-speed optical modulator enables high resolution single-photon OTDR measurement by blocking out all return light except from the region of fiber under examination.

    Abstract translation: 具有集成高速光调制器的光时域反射计(OTDR)系统能够以类似于OTDR脉冲宽度的速度运行,以提高测量分辨率,并减少采用现有方法获得高动态范围OTDR测量所需的时间 。 ASIC可用于控制调制器和产生脉冲。 高速光学调制器通过阻挡所有返回光(除了被检测的光纤区域之外),可实现高分辨率单光子OTDR测量。

    SMALL FORM FACTOR TRANSCEIVER COMPATIBLE WITH SOLDER PROCESSING
    4.
    发明申请
    SMALL FORM FACTOR TRANSCEIVER COMPATIBLE WITH SOLDER PROCESSING 审中-公开
    小尺寸因子收发器与焊接加工兼容

    公开(公告)号:WO2013155263A1

    公开(公告)日:2013-10-17

    申请号:PCT/US2013/036115

    申请日:2013-04-11

    Abstract: A fiber optic transceiver that is compatible with packaging into standard semiconductor packages and for SMT packaging, using materials and fabrication procedures that withstand solder assembly processes. The SMT package can have electrical contacts on the exterior of the package for creating electrical conduits to a substrate, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver can be of a non-SMT package configuration, being formed with electrical connection technology that allows direct connection to a substrate with electrical wiring, such as a PCB, interposer, or circuit card within a larger assembly. The fiber optic transceiver may have solderballs, metal posts or other electrical conduit technology that allows direct electrical connection to the substrate.

    Abstract translation: 一种光纤收发器,与包装成标准半导体封装和SMT封装相兼容,使用能够承受焊料组装工艺的材料和制造工艺。 SMT封装可以在封装的外部具有电触点,用于在更大的组件内形成诸如PCB,插入件或电路卡之类的基板的电导体。 光纤收发器可以是非SMT封装结构,其形成有电连接技术,其允许在更大的组件内直接连接到具有诸如PCB,插入器或电路卡之类的电线的基板。 光纤收发器可以具有焊球,金属柱或允许与衬底直接电连接的其它电气导管技术。

    COMPACT OPTICAL PACKAGE MADE WITH PLANAR STRUCTURES
    5.
    发明申请
    COMPACT OPTICAL PACKAGE MADE WITH PLANAR STRUCTURES 审中-公开
    紧凑的光学包装与平面结构

    公开(公告)号:WO2012158671A1

    公开(公告)日:2012-11-22

    申请号:PCT/US2012/037894

    申请日:2012-05-15

    CPC classification number: G02B6/4219 G02B6/4201

    Abstract: A device structure and system for connecting optical waveguides to optical transmit and receive components is described. The structure is made of two parts. The lower part contains active optoelectronic components, such as lasers and photodetectors, and optical lenses. The lower part can be assembled by steps of aligning and bonding planar components. The upper part contains optical waveguides and lenses for coupling light into and out of the waveguides. The top part is mechanically connected to the lower part to form a mechanically sound connection. The lens system provides some tolerance to mis-alignment between the top and bottom parts. The system has features that enable fiber optic components to operate and survive in harsh environments, particularly large temperature extremes.

    Abstract translation: 描述了用于将光波导连接到光发射和接收部件的装置结构和系统。 该结构由两部分组成。 下部包含有源光电子元件,如激光和光电探测器,以及光学透镜。 下部可以通过对齐和粘合平面部件的步骤组装。 上部包含用于将光耦合到和流出波导的光波导和透镜。 顶部机械地连接到下部以形成机械声音连接。 透镜系统为顶部和底部之间的对准错误提供了一些公差。 该系统具有使光纤组件能够在恶劣环境,特别是极端温度极端运行和生存的功能。

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