摘要:
An optical interface device for a photonic integrated system includes a plug and a receptacle. The receptacle is operably arranged on a PIC that supports waveguides. The plug operably supports optical fibers. The receptacle and plug are configured to operably engage to establish optical communication between the optical fibers and the waveguides. A tab on the receptacle is configured to constrain longitudinal motion while allowing for lateral motion of the receptacle to adjust its position relative to the PIC to optimize alignment. The plug can include a spacer sized to fit within a recess defined by the tab to further facilitate alignment. The receptacle and plug can be engaged and disengaged in a manner similar to conventional electrical connectors.
摘要:
The present invention relates to an optical flow cell (1) for a measuring device, having an input light guide with a light exit surface, an output light guide with a light entrance surface, said input light guide and output light guide being integrated with a holder (30) to form optical flow cell (1), and wherein the holder (30) extends along a first axis (A) and has a through hole (31) for receiving a flow of a sample fluid, said through hole (31) being transversal to said first axis (A), and the input light guide and output light guide further are arranged in said holder (30) so that the light exit surface and the light entrance surface extend into said through hole (31) and are arranged to be in optical alignment with each other and at a first distance from each other. The invention also relates to a measuring device having at least one optical flow cell (1).
摘要:
A plug connector for connecting optical fibers to an electrical receptacle connector includes a housing defining a cavity therein. At least one printed circuit board (PCB) is disposed in the housing cavity. The PCB includes one or more optoelectronic components disposed on its top surface and electrical contacts disposed proximate a mating edge of the PCB for mating with the receptacle connector. The electrical contacts are electrically connected to the one or more optoelectronic components. One or more optical fibers enter the housing cavity through a housing opening and are optically coupled to the optoelectronic components. A structure comprising a top surface is disposed within the housing cavity between the housing opening and the PCB. The plurality of the optical fibers extends over the top surface of the structure and over at least a portion of the top surface of the PCB. The plurality of the optical fibers is separated from the top surface of the PCB by a first minimum distance and from the top surface of the platform by a second minimum distance less than the first minimum distance.
摘要:
A method for manufacturing an optical assembly (10) comprises providing a first substrate (12, 14) having a first surface, providing a second substrate (12, 14) having a second surface facing the first surface, and forming a pattern microbump (22) on at least a select one of the first surface and the second surface. The method further comprises applying an adhesive (16) to the at least select one of the first surface and the second surface in a region proximate the pattern microbump, and attaching the first substrate to the second substrate by placing the first surface and the second surface in close proximity to one another such that the adhesive contacts both the first surface and the second surface, and wherein the adhesive is held within a preselected area by the pattern microbump.
摘要:
A photon emitting device (100) comprises a plurality of solid state radiation sources (104) to generate radiation. The solid state radiation sources can be disposed in an array pattern. Optical concentrators (120), arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides (130), also arranged in a corresponding array pattern. Each optical waveguide includes a first end (132) to receive the radiation and a second end (133) to output the radiation. A support structure (150) is provided to stabilize the plurality of optical waveguides between the first and second ends. The photon emitting device can provide a replacement for a discharge lamp device in various applications including road illumination, spot lighting, back lighting, image projection and radiation activated curing.
摘要:
A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.
摘要:
This invention relates to a flexible printed circuit board (102) that is used in connection with an optical transmitter, receiver or transceiver module (100). In one embodiment, the flexible printed circuit board (102) has flexible metal layers in between flexible insulating layers, and the circuit board (102) comprises: (1) a main body region (306) orientated in a first direction having at least one electrical or optoelectronic device (308); (2) a plurality of electrical contact pads integrated into the main body region (306), where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region (304) extending from one end of the main body region (306); and (4) a head region (302)extending from one end of the buckle region (304), and where the head region (302) is orientated so that is at an angle relative to the direction of the main body region (306). The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip (108) may be adapted to the head region (302) of the flexible printed circuit board (102). In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board (102), and a window is formed in the head region (302) of the flexible printed circuit board (102). Optoelectronic devices (106) are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board (102).
摘要:
An optical alignment device is provided comprising a base portion extending the length of the alignment device, a substantially horizontal package mounting portion coupled to the base portion, and a component retaining portion coupled to the base portion.