公开(公告)号：WO2011071603A2

公开(公告)日：2011-06-16

申请号：PCT/US2010/053974

申请日：2010-10-25

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

Inventor： LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/52

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/27 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/83192 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described.

Abstract translation: 描述了一种集成电路封装，其包括衬底，引线框以及位于衬底和引线框之间的一个或多个集成电路。 多个电子元件可以连接到基板的一侧或两侧。 集成电路的有源面与基板电和物理连接。 集成电路的背面安装在引线框架的芯片连接垫上。 引线框架包括物理连接到衬底并与衬底电耦合的多个引线。 模制材料包封衬底，引线框架和集成电路的部分。 还描述了形成这种包装的方法。

公开(公告)号：WO2011071566A1

公开(公告)日：2011-06-16

申请号：PCT/US2010/045802

申请日：2010-08-17

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

Inventor： LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

IPC: H01L23/495 ,  H01L23/32 ,  H01L23/52

CPC classification number: H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00

Abstract: A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes.

Abstract translation: 公开了一种具有多个引线框架的半导体芯片封装。 封装可以包括具有第一多个电引线的第一引线框架和具有多个连接条的管芯附接焊盘，大体平行于第一引线框架并具有第二多个电引线的第二引线框架以及模具或密封剂。 连接杆可以位于管芯安装垫的三个主要侧面，而不是第四个主要侧面。 可以使第一和第二多个电引线中的间隙彼此扩大或对准，以便能够消除封装区域之外的模具闪蒸，这可以通过模具腔棒突起来实现。 另外的部件可以包括主管芯，次级管芯，电感器和/或电容器。 第一引线框架和第二引线框架可以基本上彼此层叠，并且一个或两个引线框架可以是无引线引线框架。

公开(公告)号：WO2011071603A3

公开(公告)日：2011-09-29

申请号：PCT/US2010053974

申请日：2010-10-25

Applicant: NAT SEMICONDUCTOR CORP ,  LEE LEE HAN MENG EUGENE ,  WOO KUAN YEE

Inventor： LEE LEE HAN MENG EUGENE ,  WOO KUAN YEE

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/52

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/27 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/83192 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described.

Abstract translation: 描述了一种集成电路封装，其包括衬底，引线框和位于衬底和引线框之间的一个或多个集成电路。 多个电气部件可以附接到基板的一侧或两侧。 集成电路的主动面与基板电连接并物理连接。 集成电路的背面安装在引线框架的管芯附着垫上。 引线框架包括物理附接到基板并与其电耦合的多个引线。 成型材料封装基板，引线框架和集成电路的部分。 还描述了形成这种包装的方法。