公开(公告)号：WO2010121277A8

公开(公告)日：2011-11-24

申请号：PCT/AT2010000103

申请日：2010-04-14

Applicant: AUSTRIA TECH & SYSTEM TECH ,  MARELJIC LJUBOMIR ,  ZHANG ANDERSON

Inventor： MARELJIC LJUBOMIR ,  ZHANG ANDERSON

IPC: H05K3/00 ,  H05K3/34 ,  H05K13/00

CPC classification number: H05K3/0097 ,  H05K3/341 ,  H05K2203/0165 ,  H05K2203/0169 ,  H05K2203/1105

Abstract: In a method for pretreating a frame or carrier element for use in the production of a circuit board, wherein after the pretreatment the frame or carrier element is coupled to at least one circuit board element, and subjected to at least one treatment step, particularly at an elevated temperature, together with the circuit board element, in particular a population of the circuit board element, it is provided that the frame or carrier element is subjected to a heat treatment at temperatures between 120ºC and 350ºC, particularly 200ºC to 300ºC, for a time period (tges) of 5 to 300 seconds, particularly 10 to 200 seconds, whereby frame or carrier elements can be provided, which are reliably stable in terms of shape and dimensions.

Abstract translation: 在用于预处理使用的帧或载体元件在制造电路板，其中所述框架或支撑构件联接到前处理与至少一个印刷电路板元件和至少一个处理步骤，特别是在升高的温度下与印刷电路板元件一起，特别是一个方法 安装在印刷电路板元件进行，它提供的是，框架或支撑部件在120摄氏度和350摄氏度，优选200摄氏度至300摄氏度之间的温度下进行热处理，持续一段时间（TTOTAL）为5〜300秒，特别是10〜 200秒进行，从而以可靠的方式形状配合和可提供尺寸稳定的框架或载体元件。