Abstract:
A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, an apparatus is provided. The apparatus includes a carrier head movable in a travel path between at least one polishing station for polishing a substrate as the substrate is retained in the carrier head, and a transfer station for transferring the substrate to and from the carrier head, the carrier head having a retaining ring, and a sensor disposed in the travel path of the carrier head, the sensor operable to provide a metric indicative of a condition of the retaining ring.
Abstract:
A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, an apparatus is provided. The apparatus includes a carrier head movable in a travel path between at least one polishing station for polishing a substrate as the substrate is retained in the carrier head, and a transfer station for transferring the substrate to and from the carrier head, the carrier head having a retaining ring, and a sensor disposed in the travel path of the carrier head, the sensor operable to provide a metric indicative of a condition of the retaining ring.