公开(公告)号：WO2004061162A1

公开(公告)日：2004-07-22

申请号：PCT/US2003/035398

申请日：2003-11-07

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： BOYD, Steven, D. ,  KESARI, Susrut ,  LAMANNA, William, M. ,  PARENT, Michael, J. ,  ZAZZERA, Lawrence, A. ,  ZHANG, Haiyan

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C23C18/40

Abstract: The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.

Abstract translation: 本发明提供了具有铜双（全氟烷基磺酰基）酰亚胺或三（全氟烷基磺酰基）磺酸铜的电镀溶液以及使用这些电镀溶液电化学或化学沉积铜互连的方法。