Abstract:
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.
Abstract:
A lubricant composition comprising a perfluoropolyether lubricant and fluorinated ketone solvent is described. The lubricant composition can be applied as a coating to a substrate such as magnetic media. After the coating dries, a thin uniform lubricant film covers the substrate surface. The fluorinated ketone solvent can solubilize a wide range of perfluoropolyether compounds but not potential contaminants such as water and hydrocarbons. Additionally, the solvent has low potential to adversely affect global warming.
Abstract:
The present invention provides methods of polishing and/or cleaning copper interconnections using bis (perfluoroalkanesulfonyl) imide acids or tris (perfluoroalkanesulfonyl) methide acids compositions.
Abstract:
A method of making a composition comprises independently providing a first component comprising a first compound, and a second component comprising a second compound; and combining the first component and the second component, wherein: a) the first compound is represented by; and b) the second compound is represented by. R f represents a perfluoroalkyl group having from 1 to 12 carbon atoms. R 1 , R 2 , R 3 , and R 4 each independently represent H or an alkyl group having from 1 to 6 carbon atoms. R 5 represents H, an alkyl group having from 1 to 6 carbon atoms, or a hydroxyalkyl group having from 1 to 6 carbon atoms. R 6 and R 7 each independently represent an alkyl group having from 1 to 6 carbon atoms, or a hydroxyalkyl group having from 1 to 6 carbon atoms. Compositions preparable according to the method are also disclosed.
Abstract:
The present invention is directed to certain fluorinated surfactants, and use thereof in acid etch solutions, such as in aqueous buffered acid etch solutions. The etch solutions are used with a wide variety of substrates, for example, in the etching of silicon oxide-containing substrates.