ORGANIC LIGHT EMITTING DIODE CUSHIONING FILM
    1.
    发明申请
    ORGANIC LIGHT EMITTING DIODE CUSHIONING FILM 审中-公开
    有机发光二极管缓冲膜

    公开(公告)号:WO2017189214A1

    公开(公告)日:2017-11-02

    申请号:PCT/US2017/026765

    申请日:2017-04-10

    Abstract: An organic light emitting diode (OLED) cushioning film including a foamed layer is described. The foamed layer includes an olefin-styrene block copolymer at 30 to 80 weight percent and a tackifier at 15 to 60 weight percent. The tackifier has a softening point of at least 130 °C. A light emitting article including an OLED layer laminated to the OLED cushioning film is described.

    Abstract translation: 描述了包括发泡层的有机发光二极管(OLED)缓冲膜。 发泡层包含30-80重量%的烯烃 - 苯乙烯嵌段共聚物和15-60重量%的增粘剂。 增粘剂具有至少130℃的软化点。 描述了包括层压到OLED缓冲膜的OLED层的发光制品。

    NOZZLE SEALING COMPOSITION AND METHOD
    3.
    发明申请
    NOZZLE SEALING COMPOSITION AND METHOD 审中-公开
    喷嘴密封组合物和方法

    公开(公告)号:WO2009075971A2

    公开(公告)日:2009-06-18

    申请号:PCT/US2008/082711

    申请日:2008-11-07

    CPC classification number: C09J163/00 B41J2/17536 C09D11/101 Y10T428/31511

    Abstract: A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition.

    Abstract translation: 施加可固化组合物的方法。 该方法包括提供包含约10至约60重量%的一种或多种环氧树脂的可固化组合物; 约20至约80重量%的一种或多种选自聚酯树脂,乙烯乙酸乙烯酯树脂,热塑性树脂和丙烯酸酯树脂的树脂; 至多约30重量百分比的一种或多种含羟基化合物; 和选自光引发剂,热引发剂及其组合的引发剂。 该方法还包括引发可固化组合物的固化。

    ADHESIVE AND DAMPING FILM
    4.
    发明申请
    ADHESIVE AND DAMPING FILM 审中-公开
    胶粘剂和阻尼膜

    公开(公告)号:WO2017189389A1

    公开(公告)日:2017-11-02

    申请号:PCT/US2017/029047

    申请日:2017-04-24

    Abstract: Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between -40 °C and -10 °C, and the adhesive has a heat activation temperature between 20 °C and 100 °C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

    Abstract translation: 描述了包括20至50重量%的聚酯,30至60重量%的第一增粘剂和5至30重量%的第一烯烃 - 苯乙烯嵌段共聚物的粘合剂。 该聚酯的玻璃化转变温度在-40℃和-10℃之间,并且该粘合剂具有20℃和100℃之间的热活化温度。 描述了包括至少一层粘合剂并包括发泡层的阻尼膜。 发泡层包含30-80重量%的第二烯烃 - 苯乙烯嵌段共聚物和15-60重量%的第二增粘剂。

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