公开(公告)号：WO2020165759A1

公开(公告)日：2020-08-20

申请号：PCT/IB2020/051078

申请日：2020-02-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： FRITZ, Matthew C. ,  XIE, Junqing ,  LARAIA, Vincent J.

IPC: B24B37/24 ,  B24B7/22 ,  B24B37/14 ,  B24B37/22 ,  B24B37/26 ,  H01L21/304

Abstract: An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features extends. A first set of the plurality of abrasive features (i) has an average height, H 1avg , (ii) a standard deviation of less than 10% of H 1avg , and (iii) comprises between 5 and 130 abrasive features.

公开(公告)号：WO2019012391A1

公开(公告)日：2019-01-17

申请号：PCT/IB2018/054980

申请日：2018-07-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： CHEN, Chi-Fan ,  RIDDLE, Justin A. ,  LARAIA, Vincent J. ,  NELSON, Caleb T. ,  HSIEH, Wen-Hsiang ,  DAVID, Moses M. ,  JING, Naiyong ,  MA, Jun

IPC: B24B37/24 ,  B24D3/34 ,  C09K3/14

Abstract: The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a body having an abrading surface and an opposed second surface, wherein the abrading surface of the body includes a plurality of inorganic abrasive particles; a conformable metal oxide coating adjacent to and conforming to the plurality of engineered features, wherein the conformable metal oxide coating includes a first surface; and a conformable polar organic-metallic coating in contact with the first surface of the conformable metal oxide coating, wherein the conformable polar organic-metallic coating includes a chemical compound having at least one metal and an organic moiety having at least one polar functional group.

公开(公告)号：WO2008002735A2

公开(公告)日：2008-01-03

申请号：PCT/US2007/069607

申请日：2007-05-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： BEHR, Andrew H. ,  GOERS, Brian D. ,  LARAIA, Vincent J. ,  PALMGREN, Gary M. ,  PENDERGRASS, Daniel B. Jr.

CPC classification number: B24B53/017 ,  B24B37/04 ,  B24B49/02 ,  B24B49/04 ,  B24B49/14 ,  B24B49/16 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, a means for providing CMP information positioned near the substrate, and a transmitter positioned near the substrate and adapted to transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner having a means for communicating CMP information, a CMP process monitoring system, and a method for conditioning a CMP pad.

Abstract translation: 本公开涉及可用于化学机械抛光（CMP）的磨料制品，所述制品包括具有相反主表面的基材，覆盖至少一个主表面的至少一部分的研磨材料，用于提供定位的CMP信息的装置 靠近基板，以及位于基板附近并适于将CMP信息发送到远程接收器的发射器。 本公开还涉及具有用于传送CMP信息的装置，CMP处理监视系统和用于调节CMP垫的方法的CMP垫调节器。

公开(公告)号：WO2020188338A1

公开(公告)日：2020-09-24

申请号：PCT/IB2019/058438

申请日：2019-10-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： BROOKS, Brian E. ,  BENOIT, Gilles J. ,  OLSON, Peter O. ,  OLSON, Tyler W. ,  NAYAR, Himanshu ,  ARSENAULT, Frederick J. ,  JOHNSON, Nicholas A. ,  LARAIA, Vincent J. ,  WEST, Don V.

IPC: G05B13/04 ,  H01L21/304 ,  B24B37/005

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of polishing semiconductor wafers. In one aspect, the method comprises repeatedly performing the following: i) selecting a configuration of input settings for polishing a semiconductor wafer, based on a causal model that measures current causal relationships between input settings and a quality of semiconductor wafers; ii) receiving a measure of the quality of the semiconductor wafer polished with the configuration of input settings; and iii) adjusting, based on the measure of the quality of the semiconductor wafer polished with the configuration of input settings, the causal model.

公开(公告)号：WO2019012388A1

公开(公告)日：2019-01-17

申请号：PCT/IB2018/054977

申请日：2018-07-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： CHEN, Chi-Fan ,  RIDDLE, Justin A. ,  LARAIA, Vincent J. ,  NELSON, Caleb T. ,  HSIEH, Wen-Hsiang ,  DAVID, Moses M. ,  JING, Naiyong ,  MA, Jun

IPC: B32B18/00 ,  B24D3/00 ,  B24B37/00

Abstract: The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a ceramic body having an abrading surface and an opposed second surface, wherein the abrading surface of the ceramic body includes a plurality of engineered features each having a base and a distal end opposite the base and the ceramic body has a Mohs hardness of at least 7.5; a conformable metal oxide coating adjacent to and conforming to the plurality of engineered features, wherein the conformable metal oxide coating includes a first surface; and a conformable polar organic-metallic coating in contact with the first surface of the conformable metal oxide coating, wherein the conformable polar organic-metallic coating includes a chemical compound having at least one metal and an organic moiety having at least one polar functional group.