THERMAL INTERFACE MATERIAL
    2.
    发明申请

    公开(公告)号:WO2019211707A1

    公开(公告)日:2019-11-07

    申请号:PCT/IB2019/053401

    申请日:2019-04-24

    Inventor: LEE, Mi Hee

    Abstract: A thermal interface material includes a first heat conductive layer and a second heat conductive layer. The first heat conductive layer is disposed on the second heat conductive layer and shares a boundary of the same space with the second heat conductive layer. The first heat conductive layer includes a plurality of first heat conductive strips parallel-spaced from one another, wherein, when the thermal interface material is compressed with a compression rate of 20% to 70%, the adjacent first heat conductive strips expand in the lateral direction and contact each other.

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