公开(公告)号：WO2022074562A1

公开(公告)日：2022-04-14

申请号：PCT/IB2021/059130

申请日：2021-10-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： LIN, Sung-Tso ,  LIU, Ching-Yi ,  LU, Ying-Yuh ,  SU, Wei-Cheng

IPC: C09J133/06 ,  C09J133/08 ,  C09J7/38 ,  C08L33/24

Abstract: The present application is a composition including a base resin comprising between about 4% and about 15% acrylic acid monomer and an oligomer additive comprising (a) one of an acrylamide or meth(acrylamide) copolymer and (b) a high glass transition temperature monomer. The oligomer additive has a molecular weight range of between about 20,000 and about 1,000,000 and a glass transition temperature of between about 70°C and about 115°C. The composition has a blending ratio of base resin to oligomer additive of between about 7 to about 30 parts per hundred of resin.

公开(公告)号：WO2014186262A2

公开(公告)日：2014-11-20

申请号：PCT/US2014/037647

申请日：2014-05-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： TIEN, Pei ,  LEE, Mi Hee ,  WANG, Chao-Yuan ,  CHUNG, Han-Yi ,  LIU, Ching-Yi ,  LIN, Kuo-Chung ,  CHEN, Wei-Yu

IPC: H05K7/20

CPC classification number: H05K7/20481 ,  B32B3/30 ,  B32B5/18 ,  B32B7/02 ,  B32B7/12 ,  B32B9/007 ,  B32B15/08 ,  B32B15/20 ,  B32B2266/0214 ,  B32B2266/0257 ,  B32B2266/14 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2405/00 ,  B32B2457/00

Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.

Abstract translation: 本发明提供了一种散热带，其包括至少一个适于散热的散热层和至少一个粘附在散热层上的绝热层。 在至少一个隔热层中形成空隙区域，并且适于在垂直于散热带（即，厚度带）的主表面的方向上用作传热阻挡层。

公开(公告)号：WO2017014736A1

公开(公告)日：2017-01-26

申请号：PCT/US2015/041054

申请日：2015-07-20

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： TIEN, Pei ,  WANG, Chao-Yuan ,  LIU, Ching-Yi

IPC: H01L23/34 ,  H01L23/36 ,  H01L23/373

CPC classification number: H01L23/3737 ,  H01L23/36 ,  H01L23/3735

Abstract: The present invention provides a heat spreading structure comprising a first conductive layer and a composite layer that sequentially comprises a structured adhesive layer and a second conductive layer having a coating on the first conductive layer, wherein the structured adhesive layer comprises at least one polymeric region and at least one void region. The composite layer further has a grounding opening exposing a part of the first conductive layer for grounding purposes. The present invention also provides a heat spreading tape and a method for forming the same.

Abstract translation: 本发明提供一种散热结构，其包括第一导电层和复合层，其顺序地包括结构化粘合剂层和在第一导电层上具有涂层的第二导电层，其中所述结构化粘合剂层包含至少一个聚合物区域和 至少一个空隙区域。 复合层还具有露出用于接地目的的第一导电层的一部分的接地开口。 本发明还提供一种散热带及其制造方法。

公开(公告)号：WO2022208317A1

公开(公告)日：2022-10-06

申请号：PCT/IB2022/052846

申请日：2022-03-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： SAKURAI, Aizoh ,  LIU, Ching-Yi

IPC: C09J9/02 ,  C09J7/25 ,  C09J7/29 ,  C09J7/38 ,  B32B7/023 ,  B32B7/025

Abstract: A transparent heat resistive adhesive tape with antistatic performance and a method of use thereof are provided. The adhesive tape includes at least a transparent backing film layer, an electrically conductive transparent layer disposed on the backing film layer, and a transparent acrylic adhesive layer disposed on the electrically conductive transparent layer. The adhesive tape has heat resistivity and antistatic performance on an adhesive side of the tape while maintaining good optical transparency.