公开(公告)号：WO2018013645A1

公开(公告)日：2018-01-18

申请号：PCT/US2017/041655

申请日：2017-07-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： NARAG, Alejandro, Aldrin, II, A. ,  PALANISWAMY, Ravi

IPC: H01L25/075 ,  H01L33/62 ,  H05K3/40 ,  H05K3/32 ,  H05K1/18 ,  H05K1/11

Abstract: A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.

Abstract translation: 用于安装多个发光半导体器件（LESD 100,110,120）的柔性多层结构（1000）包括包括顶部（210）和底部（220）的柔性绝缘衬底（200） 主表面以及分别设置在顶部主表面和底部主表面上的多个相应导电顶部（300,310,320,330）和底部（500,510,520,530）焊盘。 导电通孔（400,410,420,430）连接每对相应的顶部和底部焊盘，每个顶部焊盘的一侧部分地与对应的底部焊盘的侧面和衬底的一侧重叠，使得在平面图 视图中，每个顶部垫完全重叠相应的底部垫。