-
公开(公告)号：WO2018207055A1
公开(公告)日：2018-11-15
申请号：PCT/IB2018/053043
申请日：2018-05-02
IPC分类号： H01L33/62 , H01L23/498
CPC分类号： H01L33/62 , H01L23/49827 , H01L2933/0066
摘要： A multilayer construction is disclosed that includes a dielectric substrate defining a through via having top and bottom openings at respective major top and bottom surfaces of the substrate. The multilayer construction also includes an electrically continuous electrode that includes first and second electrode portions disposed on the respective major top and bottom surfaces covering the respective top and bottom openings of the via, and a third electrode portion filling the via and making physical and electrical contact with the first and second electrode portions. The second electrode portion has a bottom major surface having a curved concave surface portion aligned with the through via.
-
公开(公告)号：WO2018013645A1
公开(公告)日：2018-01-18
申请号：PCT/US2017/041655
申请日：2017-07-12
摘要： A flexible multilayer construction (1000) for mounting a plurality of light emitting semiconductor devices (LESDs 100, 110, 120) includes a flexible dielectric substrate (200) comprising top (210) and bottom (220) major surfaces, and pluralities of corresponding electrically conductive top (300, 310, 320, 330) and bottom (500, 510, 520, 530) pads disposed on the top and bottom major surfaces, respectively. An electrically conductive via (400, 410, 420, 430) connects each pair of corresponding top and bottom pads, a side of each top pad partially overlapping a side of the corresponding bottom pad and a side of the substrate, such that in a plan view, each top pad fully overlaps the corresponding bottom pad.
摘要翻译： 用于安装多个发光半导体器件（LESD 100,110,120）的柔性多层结构（1000）包括包括顶部（210）和底部（220）的柔性绝缘衬底（200） 主表面以及分别设置在顶部主表面和底部主表面上的多个相应导电顶部（300,310,320,330）和底部（500,510,520,530）焊盘。 导电通孔（400,410,420,430）连接每对相应的顶部和底部焊盘，每个顶部焊盘的一侧部分地与对应的底部焊盘的侧面和衬底的一侧重叠，使得在平面图 视图中，每个顶部垫完全重叠相应的底部垫。
-
3.发明申请
公开(公告)号：WO2016153644A1
公开(公告)日：2016-09-29
申请号：PCT/US2016/018401
申请日：2016-02-18
发明人： PALANISWAMY, Ravi
CPC分类号： H05K1/0209 , H01L33/642 , H05K1/0207 , H05K1/111 , H05K1/189 , H05K3/28 , H05K2201/0162 , H05K2201/0209 , H05K2201/09681 , H05K2201/09827 , H05K2201/10106
摘要： A flexible multilayer substrate for attaching a light emitting semiconductor device includes a first dielectric layer, a circuit layer on the first dielectric layer; a first thermally conductive layer on the circuit layer; a discontinuous metal support layer having a plurality of openings therethrough disposed on the first thermally conductive layer, and a second thermally conductive layer on the support layer. The flexible multilayer substrate further includes a plurality of conductive vias extending through the first dielectric layer such that the circuit layer is in communication with the plurality of conductive vias. The first and second thermally conductive layers are in contact within said openings.
摘要翻译： 用于附着发光半导体器件的柔性多层基片包括第一介电层，第一介电层上的电路层; 电路层上的第一导热层; 具有穿过其设置在第一导热层上的多个开口的不连续金属支撑层和在支撑层上的第二导热层。 柔性多层基板还包括延伸穿过第一介电层的多个导电通孔，使得电路层与多个导电通孔连通。 第一和第二导热层在所述开口内接触。
-
4.发明申请FLEXIBLE CIRCUITS WITH COPLANAR CONDUCTIVE FEATURES AND METHODS OF MAKING SAME 审中-公开具有共模导电特性的柔性电路及其制造方法
公开(公告)号：WO2015148185A1
公开(公告)日：2015-10-01
申请号：PCT/US2015/021023
申请日：2015-03-17
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L21/4846 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L33/46 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/64 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
摘要： Flexible LED assemblies that have coplanar integrated conductive features upon which an LED can be mounted, and methods of making such LED assemblies are described. The flexible LED assembly includes a flexible polymer substrate, a first conductive feature, a second conductive feature and an LED. The first conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The second conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The first and second conductive features are separated by a gap therebetween. The LED is mounted on both the first and second conductive features, and the first and second conductive features are substantially coplanar with one another.
摘要翻译： 描述具有可以安装LED的共面集成导电特征的柔性LED组件，以及制造这种LED组件的方法。 柔性LED组件包括柔性聚合物衬底，第一导电特征，第二导电特征和LED。 第一导电特征位于柔性基底内和柔性基底的表面上。 第二导电特征位于柔性基底内和柔性基底的表面上。 第一和第二导电特征由它们之间的间隙分开。 LED安装在第一和第二导电特征两者上，并且第一和第二导电特征基本上彼此共面。
-
5.发明申请
公开(公告)号：WO2015084851A1
公开(公告)日：2015-06-11
申请号：PCT/US2014/068167
申请日：2014-12-02
发明人： PALANISWAMY, Ravi , GAO, Jian Xia , NARAG, Alejandro Aldrin A. II , KREUTTER, Nathan P. , OUDERKIRK, Andrew J.
IPC分类号： H01L25/075 , H01K1/02 , H05K1/18 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/62 , H01L33/64 , H01L33/642 , H01L33/644 , H01L2224/48091 , H01L2224/48137 , H01L2224/49176 , H05K1/0206 , H05K1/189 , H05K2201/09827 , H05K2201/10106 , H05K2203/049 , H01L2924/00014
摘要： A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).
摘要翻译： 具有第一和第二主表面的柔性聚合物电介质层（12），所述第一主表面上具有导电层（20），所述电介质层具有从所述第二主表面延伸到所述第一主表面的至少一个导管（10） 导管具有至少约一厘米的至少一个横向尺寸并且至少部分地填充有导电材料（18），所述导电层包括基本上与导管（10）对准的至少一个导电特征（21） 导电特征（21）支撑多个发光半导体器件（22）。
-
公开(公告)号：WO2014113045A1
公开(公告)日：2014-07-24
申请号：PCT/US2013/030657
申请日：2013-03-13
申请人： 3M INNOVATIVE PROPERTIES COMPANY , NARAG, Alejandro Aldrin II Agcaoili , PALANISWAMY, Ravi , TAN, Bee Leng , FLOR, Antonny E.
CPC分类号： H01L23/49838 , H01L23/49827 , H01L23/4985 , H01L23/49866 , H01L23/49894 , H01L33/486 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2924/12032 , H01S5/02272 , H01S5/02276 , H01L2924/00014 , H01L2924/00
摘要： Provided is an article for supporting an LESD comprising a dielectric layer having a first major surface with a conductive layer thereon and a second major surface, the dielectric layer having at least three vias extending from the second major surface to the first major surface, the conductive layer comprising at least first and second conductive features, wherein the first conductive feature is adjacent an opening of at least a first via and the second conductive feature is adjacent an opening of at least a second and a third via.
摘要翻译： 提供了一种用于支撑LESD的物品，其包括具有在其上具有导电层的第一主表面和第二主表面的电介质层，所述电介质层具有从第二主表面延伸到第一主表面的至少三个通孔，导电 层，其至少包括第一和第二导电特征，其中所述第一导电特征与至少第一通孔的开口相邻，并且所述第二导电特征与至少第二和第三通孔的开口相邻。
-
公开(公告)号：WO2022118261A1
公开(公告)日：2022-06-09
申请号：PCT/IB2021/061265
申请日：2021-12-02
发明人： SABADE, Milind B. , PALANISWAMY, Ravi , ROGERS, Ryan J. , EMSLANDER, Diane L. , JULIAN, Dominic J.
摘要： The present invention is a thermal management device including a power source, a flexible thermoelectric module, and a first phase change material.
-
公开(公告)号：WO2019186314A1
公开(公告)日：2019-10-03
申请号：PCT/IB2019/052098
申请日：2019-03-14
发明人： PALANISWAMY, Ravi , CARAIG, Donato G. , GAO, Jian Xia , NARAG, Alejandro Aldrin II , FOO, Siang Sin , FLOR, Antonny E.
摘要： Flexible thermoelectric devices including an array of slot openings on a flexible substrate, and methods of making and using the same are provided. The slot openings on the flexible substrate can help remove the tension or compression induced during bending of the devices. Slot openings each extend along a cross direction substantially perpendicular to the longitudinal direction of the substrate.
-
公开(公告)号：WO2017222862A1
公开(公告)日：2017-12-28
申请号：PCT/US2017/037117
申请日：2017-06-13
发明人： LEE, Jae Yong , BARTON, Roger W. , BOWEN, Emily L. , CARAIG, Donato G. , HUGHES, Gareth A. , PALANISWAMY, Ravi , POCH, James F. , DOLEZAL, Michael W.
摘要： At least some aspects of the present disclosure direct to a flexible thermoelectric module. The thermoelectric module includes a flexible substrate, a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, a first set of connectors, and a second set of connectors. The substrate includes a plurality of vias filled with an electrically conductive material or thermoelectric elements. In some cases, the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are disposed on the flexible substrate.
-
公开(公告)号：WO2016109168A2
公开(公告)日：2016-07-07
申请号：PCT/US2015/065504
申请日：2015-12-14
发明人： GABRIEL, Nicholas T. , JESME, Ronald D. , OUDERKIRK, Andrew J. , PALANISWAMY, Ravi , BONIFAS, Andrew P. , NARAG, Alejandro Aldrin A., II , JENNINGS, Robert M. , GORRELL, Robin E.
CPC分类号： H05K1/0283 , G06K19/025 , H01Q1/2225 , H01Q1/36 , H05K1/165 , H05K2201/09263 , H05K2201/09272 , H05K2201/09727 , H05K2201/09736 , H05K2201/10098
摘要： Electrical conductors are disclosed. More particularly, undulating electrical conductors are disclosed. Certain disclosed electrical conductors may be suitable to be disposed on flexible or stretchable substrates.
摘要翻译： 电导体被公开。 更具体地，公开了起伏的电导体。 某些公开的电导体可以适于设置在柔性或可拉伸的基底上。
-
-
-
-
-
-
-
-
-
搜索结果
41 条记录 (耗时 0.017 秒)
