摘要:
A method for forming an article of manufacture using additive manufacturing, includes: a processor executing program instructions to: (a) rotate an object continuously about a horizontal axis using a first rotational stage, wherein the object is partially submerged in a bath of energy curable liquid formulation during the rotation; (b) control a rate of rotation of the object to achieve a desired radial thickness of a sub layer of uncured liquid formulation at a desired rotational location on the object; (c) direct an energy source to provide an energy dose onto the object at a desired rotational location, wherein the energy dose is configured to cure and solidify the sub layer; and repeat (a), (b) and (c) until a desired radial thickness of a cured liquid formulation layer is achieved.
摘要:
A sintered magnet (1), e.g. for an electrical machine, the sintered magnet comprising a core portion (3), a shell portion (2) arranged at an outer part of the sintered magnet, and a diffusion portion (4) arranged at least partially between the core portion and the shell portion. The shell portion (2) has a coercivity, which is at least 30 kA/m larger than the coercivity of the core portion (3). In the diffusion portion (4), the coercivity is not less than the coercivity of the core portion (3) and not larger than the coercivity of the shell portion (2) and the value of the coercivity gradually increases from the core portion (3) towards the shell portion (2). T the thickness of the core portion (3) is not less than 1 mm and the total thickness of the shell portion (2) and the diffusion portion (4) is at least 5 mm.
摘要:
Unique systems, methods, techniques and apparatuses of a modular power transformer are disclosed. One exemplary embodiment is a matrix power transformer including a plurality of block assemblies each including a plurality of transformer modules, each transformer module including a primary winding coupled to an input and a secondary winding coupled to an output, the inputs of each transformer module in one block assembly being coupled together and the outputs of each transformer block being coupled together. One of the secondary windings includes a plurality of taps structured to be selectively coupled to the output of the associated transformer module assembly or another secondary winding of the associated module assembly.
摘要:
A method for forming a fiber-reinforced cable tie includes placing at least one reinforcing fiber in a mold cavity, injecting a molten material in the mold cavity, wherein the molten material defines a melt front during injection, and maintaining a position of the reinforcing fiber within the mold cavity at the melt front during the injecting of the melt, whereby the fiber is substantially encapsulated by the molten material. A mold for forming a fiber-reinforced cable tie includes a mold cavity and a fiber guide movably supported within the mold cavity for maintaining a position of a reinforcing fiber placed within the mold cavity during injection of a molten material into the mold cavity.
摘要:
The present disclosure relates to a method of building an insulation system around a naked conductor section of a power cable, which power cable has a conductor which includes the naked conductor section and which power cable comprises an insulation system already provided around a majority of the conductor. The insulation system comprises an inner semiconducting layer arranged around the conductor, an insulation layer arranged around the inner semiconducting layer, and an outer semiconducting layer arranged around the insulation layer, and which conductor has a naked conductor section. The method comprises: a) placing the naked conductor section in a mould, and b) moulding an insulation system around the naked conductor section, wherein the moulding of the insulation system involves injecting a first semiconducting compound into a first mould cavity to form an inner semiconducting layer around the naked conductor section, injecting an insulation compound into a second mould cavity to form an insulation layer around the inner semiconducting layer, and injecting a second semiconducting compound into a third mould cavity to form an outer semiconducting layer around the insulation layer.