公开(公告)号：WO1999014823A1

公开(公告)日：1999-03-25

申请号：PCT/US1997016297

申请日：1997-09-16

Applicant: ADVANCED INTERCONNECTIONS CORPORATION

Inventor： ADVANCED INTERCONNECTIONS CORPORATION ,  MURPHY, James, V. ,  MURPHY, Michael, J. ,  FISHER, Burton ,  TAYLOR, Robert

IPC: H01R09/09

CPC classification number: H01R13/2478 ,  H01R13/2485 ,  H05K3/325 ,  H05K7/1061 ,  H05K7/1084

Abstract: A ball grid array assembly (10) consists of a socket body (24) having a plurality of vias (30) extending therethrough, a plurality of electrically conductive contact assemblies (26) respectively disposed in corresponding vias (30), and a releasable cover plate (28). Each of the contact assemblies (26) includes a lower terminal end for engaging a terminal pad (14) on a circuit board (16), and further includes an upper multi-fingered contact arrangement (48) for engaging a ball contact (20) of a ball grid array package (12). Three separate embodiments are disclosed. In use, the ball grid array package (12) is received in assembled relation with the socket body (24) wherein the ball contacts (20) of the ball grid array package (12) are received into the vias (30) in engaging electrical communication with the upper contact ends of the contacts assemblies (26).

Abstract translation: 球栅阵列组件（10）由具有穿过其延伸的多个通孔（30）的插座本体（24）组成，分别设置在对应的通路（30）中的多个导电触头组件（26）和可释放的盖 板（28）。 每个接触组件（26）包括用于接合电路板（16）上的端子焊盘（14）的下终端，并且还包括用于接合球接触件（20）的上多个多指接触装置（48） 的球栅阵列封装（12）。 公开了三个单独的实施例。 在使用中，球栅阵列封装（12）以与插座主体（24）组装的关系接收，其中球栅阵列封装（12）的球触点（20）被接收到通孔（30）中，以接合电 与触头组件（26）的上接触端的连通。